Complete SOC for security, communications, storage and embedded designs
Based on Intel® architecture, the Intel® EP80579 Integrated Processor product line is the first in a series of breakthrough system on-a-chip (SOC) processors, delivering excellent performance-per-watt for small form factor designs.
This fully compatible product line (Intel EP80579 Integrated Processor and Intel® EP80579 Integrated Processor with Intel® QuickAssist Technology) provides an outstanding combination of performance, power efficiency, footprint savings and cost-effectiveness compared to discrete, multi-chip solutions.
These integrated processors are ideal for small-to-medium business (SMB) and enterprise security and communications appliances (including VPN/firewall and unified threat management), transaction terminals, interactive clients, print and imaging applications, wireless and WiMax access applications, SMB and home network attached storage, converged IP PBX solutions, converged access platforms, IP media servers, VoIP gateways and industrial automation applications.
Product highlights
These SOCs include an Intel architecture complex based on the Intel® Pentium® M processor, integrated memory controller hub, integrated I/O controller hub, and flexible integrated I/O support with three Ethernet MACs, two Controller Area Network interfaces and a local expansion bus interface.
The Intel EP80579 Integrated Processor with Intel QuickAssist Technology also includes High Speed Serial¹ ports for TDM or analog voice connectivity, security accelerators for bulk encryption, hashing and public/private key generation, and data path acceleration. The integrated accelerators support Intel QuickAssist Technology through software packages provided by Intel.
Intel provides the following software packages for embedded, security and IP telephony designs:
Intel® EP80579 Software Drivers for Embedded Applications contains all software drivers needed to utilize the hardware features on the integrated processor.
Intel EP80579 Software for Security Applications on Intel QuickAssist Technologybuilds upon the software drivers for embedded and enables acceleration of cryptographic and packet processing for a wide variety of applications.
Intel EP80579 Software for IP Telephony Applications on Intel QuickAssist Technology builds upon the software for security applications by adding features important for converged IP PBX solutions, converged access platforms, IP media servers and VoIP gateways.
Intel® EP80579 Integrated Processor
Product Number
Core Speed
DDR2 Memory (MHz)
Temp Range
L2 Data Coherent Cache
Thermal Design Power² (estimated)
NU80579EZ600C
600 MHz
400/533/667
Commercial0 to 70° C
256 KB
11 W
NU80579EZ600CT
600 MHz
400/533/667
Industrial-40 to 85° C
256 KB
11 W
NU80579EZ004C
1.066 GHz
400/533/667/800
Commercial0 to 70° C
256 KB
18 W
NU80579EZ009C
1.2 GHz
400/533/667/800
Commercial0 to 70° C
256 KB
19 W
Intel® EP80579 Integrated Processor with Intel® QuickAssist Technology
Product Number
Core Speed
DDR2 Memory (MHz)
Temp Range
L2 Data Coherent Cache
Thermal Design Power² (estimated)
NU80579EB600C
600 MHz
400/533/667
Commercial0 to 70° C
256 KB
13 W
NU80579ED004C
1.066 GHz
400/533/667/800
Commercial0 to 70° C
256 KB
20 W
NU80579ED004CT
1.066 GHz
400/533/667/800
Industrial-40 to 85° C
256 KB
20 W
NU80579ED009C
1.2 GHz
400/533/667/800
Commercial0 to 70° C
256 KB
21 W
Friday, December 12, 2008
Intel® Atom™ Processor N270
The Intel® Atom™ processor N270Ω, implemented in 45nm technology, is power-optimized and delivers robust performance-per-watt for cost-effective embedded solutions. Featuring extended lifecycle support, this processor offers an excellent solution for embedded market segments such as digital signage, interactive clients (kiosks, point-of-sale terminals), thin clients, digital security, residential gateways, print imaging, and commercial and industrial control. The processor remains software compatible with previous 32-bit Intel® architecture and complementary silicon.
This single-core processor is validated with the mobile Intel® 945GSE Express Chipset, consisting of the Intel® 82945GSE Graphics Memory Controller Hub and Intel® I/O Controller Hub 7-M. The chipset features power-efficient graphics with an integrated 32-bit 3D graphics engine based on Intel® Graphics Media Accelerator 950 architecture with SDVO, LVDS, CRT, and TV-Out display ports. It provides rich I/O capabilities and flexibility via high-bandwidth interfaces such as PCI Express,* PCI, Serial ATA, and Hi-Speed USB 2.0 connectivity.
Product highlights
Intel Atom processor N270 at 1.6 GHz core speed with 533 MHz AGTL+ front-side bus and 2.5 watts thermal design power¹ (TDP)
Intel hafnium-based 45nm Hi-k metal gate silicon process technology reduces power consumption, increases switching speed, and significantly increases transistor density over previous 65nm technology
Intel® Hyper-Threading Technology² (two threads) provides high performance-per-watt efficiency in an in-order pipeline and increased system responsiveness in multi-tasking environments. One execution core is seen as two logical processors, and parallel threads are executed on a single core with shared resources
Enhanced Intel SpeedStep® Technology reduces average system power consumption
Product Name
Core Speed
Front-Side Bus Speed
L2 Cache
L1 Cache
Thermal Design Power
Tjunction
Package
Intel® Atom™ processor N270
1.6 GHz
533 MHz
On-die 512 KB, 8-way
32 KB instruction cache
24 KB write-back data cache
2.5 W
0 to 90° C
437-ball lead-free FCBGA8 22 mm x 22 mm
This single-core processor is validated with the mobile Intel® 945GSE Express Chipset, consisting of the Intel® 82945GSE Graphics Memory Controller Hub and Intel® I/O Controller Hub 7-M. The chipset features power-efficient graphics with an integrated 32-bit 3D graphics engine based on Intel® Graphics Media Accelerator 950 architecture with SDVO, LVDS, CRT, and TV-Out display ports. It provides rich I/O capabilities and flexibility via high-bandwidth interfaces such as PCI Express,* PCI, Serial ATA, and Hi-Speed USB 2.0 connectivity.
Product highlights
Intel Atom processor N270 at 1.6 GHz core speed with 533 MHz AGTL+ front-side bus and 2.5 watts thermal design power¹ (TDP)
Intel hafnium-based 45nm Hi-k metal gate silicon process technology reduces power consumption, increases switching speed, and significantly increases transistor density over previous 65nm technology
Intel® Hyper-Threading Technology² (two threads) provides high performance-per-watt efficiency in an in-order pipeline and increased system responsiveness in multi-tasking environments. One execution core is seen as two logical processors, and parallel threads are executed on a single core with shared resources
Enhanced Intel SpeedStep® Technology reduces average system power consumption
Product Name
Core Speed
Front-Side Bus Speed
L2 Cache
L1 Cache
Thermal Design Power
Tjunction
Package
Intel® Atom™ processor N270
1.6 GHz
533 MHz
On-die 512 KB, 8-way
32 KB instruction cache
24 KB write-back data cache
2.5 W
0 to 90° C
437-ball lead-free FCBGA8 22 mm x 22 mm
Intel® Core™2 Quad Processor Q9400
The Intel® Core™2 Quad processor Q9400¹ is the first quad-core processor within the Intel® Core™2 processor product line with embedded lifecycle support. Based on Intel® Core™ microarchitecture, it features four complete execution cores within a single processor, delivering exceptional performance and responsiveness in multi-threaded and multi-tasking environments. As a result, more instructions can be carried out per clock cycle, shorter and wider pipelines execute commands more quickly, and improved bus lanes move data throughout the system faster.
The processor is validated with three different chipsets, providing a choice of flexible, quad-core-capable platforms for a wide range of embedded applications:
Intel® Q45 Express chipset for applications such as point-of-sale (POS) terminals or digital signs in a networked retail environment. Chipset consists of the Intel® 82Q45 Graphics and Memory Controller Hub (GMCH) and Intel® I/O Controller Hub (ICH) 10 DO.
Intel® Q35 Express chipset for embedded applications needing graphics, manageability, data protection and security such as interactive clients (i.e. POS terminals and interactive PCs), industrial control and automation, gaming, print imaging and network security appliances. Chipset consists of the Intel® 82Q35 GMCH and the Intel® ICH9 DO.
Intel® 3210 chipset is a server-class chipset that includes Error Correcting Code memory for embedded applications needing high reliability, such as robotics on a factory floor, multi-function printers and network security applications.
Product highlights
Multi-processing capabilities of the four complete execution cores deliver sharper images, provide faster response rates and support additional multi-media features - ideal for gaming arcade consoles, POS terminals and digital signage.
In multi-tasking environments, where rendering and manageability as well as media and software applications can be distributed to run in parallel across each of the four cores, greater visualization and realism can be attained.
The processor includes a Super Shuffle Engine to increase the speed of existing Intel® Streaming SIMD Extensions (SSE) algorithms optimized for graphics and multi-media processing. The engine significantly improves performance for the latest Intel® SSE4 instructions which enhance video editing and encoding used in many embedded applications.
Intel® Wide Dynamic Execution enables delivery of more instructions per clock cycle to improve execution time and energy efficiency
Intel® Intelligent Power Capability of the processor is designed to deliver more energy-efficient performance
Larger Intel® Advanced Smart Cache in the processor is optimized for multi-core processors, providing a higher-performance, more efficient cache subsystem
Dual Intel® Dynamic Acceleration Technology improves four-core performance by utilizing power headroom of idle cores by dynamically boosting frequency of active cores
Product name
Core speed
Front-side bus speed
L2 shared cache²
Thermal design power
VID
Tcase (max)
Package
Intel® Core™2 Quad processor Q9400
2.66GHz
1333MHz
6MB
95W
0.85 -1.3625V
71.4º C
LGA 775
The processor is validated with three different chipsets, providing a choice of flexible, quad-core-capable platforms for a wide range of embedded applications:
Intel® Q45 Express chipset for applications such as point-of-sale (POS) terminals or digital signs in a networked retail environment. Chipset consists of the Intel® 82Q45 Graphics and Memory Controller Hub (GMCH) and Intel® I/O Controller Hub (ICH) 10 DO.
Intel® Q35 Express chipset for embedded applications needing graphics, manageability, data protection and security such as interactive clients (i.e. POS terminals and interactive PCs), industrial control and automation, gaming, print imaging and network security appliances. Chipset consists of the Intel® 82Q35 GMCH and the Intel® ICH9 DO.
Intel® 3210 chipset is a server-class chipset that includes Error Correcting Code memory for embedded applications needing high reliability, such as robotics on a factory floor, multi-function printers and network security applications.
Product highlights
Multi-processing capabilities of the four complete execution cores deliver sharper images, provide faster response rates and support additional multi-media features - ideal for gaming arcade consoles, POS terminals and digital signage.
In multi-tasking environments, where rendering and manageability as well as media and software applications can be distributed to run in parallel across each of the four cores, greater visualization and realism can be attained.
The processor includes a Super Shuffle Engine to increase the speed of existing Intel® Streaming SIMD Extensions (SSE) algorithms optimized for graphics and multi-media processing. The engine significantly improves performance for the latest Intel® SSE4 instructions which enhance video editing and encoding used in many embedded applications.
Intel® Wide Dynamic Execution enables delivery of more instructions per clock cycle to improve execution time and energy efficiency
Intel® Intelligent Power Capability of the processor is designed to deliver more energy-efficient performance
Larger Intel® Advanced Smart Cache in the processor is optimized for multi-core processors, providing a higher-performance, more efficient cache subsystem
Dual Intel® Dynamic Acceleration Technology improves four-core performance by utilizing power headroom of idle cores by dynamically boosting frequency of active cores
Product name
Core speed
Front-side bus speed
L2 shared cache²
Thermal design power
VID
Tcase (max)
Package
Intel® Core™2 Quad processor Q9400
2.66GHz
1333MHz
6MB
95W
0.85 -1.3625V
71.4º C
LGA 775
Intel® Xeon® Processors LV and ULV
The Intel® Xeon® processor LV and Intel® Xeon® processor ULV are members of Intel’s growing product line of multi-core processors. Each dual-core processor combines the benefits of two high-performance execution cores with intelligent power management features to deliver significantly greater performance-per-watt over previous single-core Intel Xeon processor-based platforms. The dual-core/dual-processor capabilities are ideal for a wide range of low-power communications and embedded applications.
Product highlights
Two complete execution cores in one processor package provide advancements in simultaneous computing such as multi-threaded applications and multi-tasking environments. Dual-core processing efficiently delivers performance while balancing power requirements
High-performance front-side bus (FSB) provides dual-processor support for demanding high-performance, volume applications. Combined with dual-core processing, this supports up to four simultaneous threads on the system
Enhanced Intel SpeedStep® technology allows a system to dynamically adjust processor voltage and core frequency, decreasing average power consumption and average heat production
Intel® Smart Cache Design allows two execution cores to share 2 MB of L2 cache, reducing FSB traffic and enhancing system responsiveness
Intel® Advanced Thermal Manager supports new digital temperature sensors and thermal monitors on each execution core to enhance thermal monitoring accuracy
Enhanced 36-bit memory addressing supports up to 16 GB of DDR2 memory, when paired with the Intel® E7520 chipset
Product Number
Core Speed
Front-Side Bus Speed
L2 Cache
Thermal Design Power
VID
Tjunction
Package
LF80539KF0412M
2.0 GHz
667 MHz
2M
31W
0.825 – 1.275V
0-100° C
478 µFC-PGA
LF80539KF0282M
1.66 GHz
667 MHz
2M
31W
0.825V – 1.275V
0-100° C
478 µFC-PGA
LF80539JF0282M
1.66 GHz
667 MHz
2M
15W
0.825V – 1.2125V
0-100° C
478 µFC-PGA
Product highlights
Two complete execution cores in one processor package provide advancements in simultaneous computing such as multi-threaded applications and multi-tasking environments. Dual-core processing efficiently delivers performance while balancing power requirements
High-performance front-side bus (FSB) provides dual-processor support for demanding high-performance, volume applications. Combined with dual-core processing, this supports up to four simultaneous threads on the system
Enhanced Intel SpeedStep® technology allows a system to dynamically adjust processor voltage and core frequency, decreasing average power consumption and average heat production
Intel® Smart Cache Design allows two execution cores to share 2 MB of L2 cache, reducing FSB traffic and enhancing system responsiveness
Intel® Advanced Thermal Manager supports new digital temperature sensors and thermal monitors on each execution core to enhance thermal monitoring accuracy
Enhanced 36-bit memory addressing supports up to 16 GB of DDR2 memory, when paired with the Intel® E7520 chipset
Product Number
Core Speed
Front-Side Bus Speed
L2 Cache
Thermal Design Power
VID
Tjunction
Package
LF80539KF0412M
2.0 GHz
667 MHz
2M
31W
0.825 – 1.275V
0-100° C
478 µFC-PGA
LF80539KF0282M
1.66 GHz
667 MHz
2M
31W
0.825V – 1.275V
0-100° C
478 µFC-PGA
LF80539JF0282M
1.66 GHz
667 MHz
2M
15W
0.825V – 1.2125V
0-100° C
478 µFC-PGA
Intel® Celeron® Processor 440
The Intel® Celeron® processor 440Δ balances proven technology with exceptional value for embedded computing designs such as print imaging, gaming, interactive clients, and industrial automation. Featuring Intel® Intelligent Power Capability, it supports smaller, quieter, more energy-efficient embedded systems with improved performance over previous Intel Celeron processors.
Manufactured on 65nm process technology, the Intel Celeron processor 440Δ at 2.0 GHz offers 512 KB of L2 cache with a thermal design power (TDP) of 35 watts. Based on a new energy-efficient microarchitecture, this Celeron processor enables smaller and quieter embedded designs. It features Execute Disable Bit° (for built-in security support) as well as Intel® 64 architectureΦ (Intel® 64), enabling applications to access larger amounts of memory when used with appropriate 64-bit supporting hardware and software.
The Intel Celeron processor 440Δ is available in an LGA-775 package with integrated heat spreader. When combined with the Intel® Q45 Express Chipset, Intel® Q35 Express Chipset, Intel® Q965 Express Chipset or Intel® 3210 Chipset, the platform provides exceptional value with mid-range performance and reduced power.
Features and benefits
800 MHz front-side bus
Provides accelerated access to data from the processor core.
Intel® Wide Dynamic Execution
Improves execution speed and efficiency, delivering more instructions per clock cycle.
Intel® Smart Memory Access
Optimizes use of data bandwidth from the memory subsystem to accelerate out-of-order execution, keeping the pipeline full while improving instruction throughput and performance. Newly designed prediction mechanism reduces the time in-flight instructions must wait for data. Pre-fetch algorithms move data from system memory into fast L2 cache in advance of execution.
Intel® Advanced Digital Media Boost
Accelerates execution of Streaming SIMD Extension (SSE/2/3) instructions to significantly improve media boost performance on a broad range of applications. 128-bit SSE instructions are issued at a throughput rate of one/clock cycle, effectively doubling speed of execution over previous-generation processors.
Execute Disable Bit°
Enhances virus protection when deployed with supported operating system. Allows memory to be marked as executable or non-executable, allowing the processor to raise an error to the operating system, thereby preventing malicious code from infecting the system.
Intel® 64 ArchitectureΦ (Intel® 64)
Enables access to larger amounts of memory and provides flexibility for 32-bit and 64-bit applications. With appropriate supporting hardware and software, platforms supporting 64-bit computing can use extended virtual and physical memory.
Intel® Celeron® processor 440
Product number
Core speed
Front-side bus speed
L2 cache
Thermal design power
VID¹
Tcase(Max²)
HH80557RG041512
2.0 GHz
800 MHz
512 KB
35 W
1.000V - 1.3375V
60.4° C
Manufactured on 65nm process technology, the Intel Celeron processor 440Δ at 2.0 GHz offers 512 KB of L2 cache with a thermal design power (TDP) of 35 watts. Based on a new energy-efficient microarchitecture, this Celeron processor enables smaller and quieter embedded designs. It features Execute Disable Bit° (for built-in security support) as well as Intel® 64 architectureΦ (Intel® 64), enabling applications to access larger amounts of memory when used with appropriate 64-bit supporting hardware and software.
The Intel Celeron processor 440Δ is available in an LGA-775 package with integrated heat spreader. When combined with the Intel® Q45 Express Chipset, Intel® Q35 Express Chipset, Intel® Q965 Express Chipset or Intel® 3210 Chipset, the platform provides exceptional value with mid-range performance and reduced power.
Features and benefits
800 MHz front-side bus
Provides accelerated access to data from the processor core.
Intel® Wide Dynamic Execution
Improves execution speed and efficiency, delivering more instructions per clock cycle.
Intel® Smart Memory Access
Optimizes use of data bandwidth from the memory subsystem to accelerate out-of-order execution, keeping the pipeline full while improving instruction throughput and performance. Newly designed prediction mechanism reduces the time in-flight instructions must wait for data. Pre-fetch algorithms move data from system memory into fast L2 cache in advance of execution.
Intel® Advanced Digital Media Boost
Accelerates execution of Streaming SIMD Extension (SSE/2/3) instructions to significantly improve media boost performance on a broad range of applications. 128-bit SSE instructions are issued at a throughput rate of one/clock cycle, effectively doubling speed of execution over previous-generation processors.
Execute Disable Bit°
Enhances virus protection when deployed with supported operating system. Allows memory to be marked as executable or non-executable, allowing the processor to raise an error to the operating system, thereby preventing malicious code from infecting the system.
Intel® 64 ArchitectureΦ (Intel® 64)
Enables access to larger amounts of memory and provides flexibility for 32-bit and 64-bit applications. With appropriate supporting hardware and software, platforms supporting 64-bit computing can use extended virtual and physical memory.
Intel® Celeron® processor 440
Product number
Core speed
Front-side bus speed
L2 cache
Thermal design power
VID¹
Tcase(Max²)
HH80557RG041512
2.0 GHz
800 MHz
512 KB
35 W
1.000V - 1.3375V
60.4° C
Intel® Pentium® M Processor
The Intel® Pentium® M processor utilizes a new microarchitecture to meet the current and future demands of high-performance, low-power embedded computing, making it ideal for medium-to-large enterprise communications applications, transaction terminal, interactive client, and industrial automation applications. While incorporating advanced processor technology, it remains software-compatible with previous members of the Intel® microprocessor family.The Intel Pentium M Processor on 0.13u process technology is validated with the Intel E7501 and Intel 855GME chipsets. The Intel Pentium M Processor on 90nm process technology is validated with the Intel E7501, 855GME, E7520, E7320 chipsets, Mobile Intel® 915GME Express Chipset and Intel® 3100 (see table for details). These unique platform combinations help address a variety of customer requirements.
Intel® Pentium® M Processor
CoreSpeed(GHz)
ChipsetsSupported
Front-sideBus Speed
L2Cache
ThermalDesignPower
VID
Tjunction
Package
Product Number
90nm Process Technology
2.0 GHz
Intel®915GME & ICH-6M andE7520 & E7320
533 MHz
2 MB
27W
1.260V-1.356V
0-100°C
478 µFC-PGA
RH80536GE0412M(Pentium Mprocessor 760Δ)
2.0 GHz
Intel®915GME & ICH-6M andE7520 & E7320
533 MHz
2 MB
27W
1.260V-1.356V
0-100°C
479 µFC-BGA
RJ80536GE0412M(Pentium Mprocessor 760
1.8 GHz
Intel®915GME & ICH-6M,855GME & ICH-4,855GME & 6300ESB ICH, E7501, and E7520 & E7320,Intel 3100
400 MHz
2 MB
21W
1.276V-1.340V
0-100°C
478 µFC-PGA
RH80536GC0332M(Pentium Mprocessor 745)
1.8 GHz
Intel®915GME & ICH-6M,855GME & ICH-4,855GME & 6300ESB ICH, E7501, and E7520 & E7320,Intel 3100
400 MHz
2 MB
21W
1.276V-1.340V
0-100°C
479 µFC-BGA
RJ80536GC0332M(Pentium Mprocessor 745)
1.4 GHz
Intel®915GME & ICH-6M,855GME & ICH-4,855GME & 6300ESB ICH, E7501, and E7520 & E7320,Intel 3100
400 MHz
2 MB
10W
1.116V
0-100°C
479 µFC-BGA
RJ80536LC0172M(Pentium Mprocessor LV 738)
.13µ Process Technology
1.6 GHz
Intel®855GME & ICH-4,855GME & 6300ESB ICH, andE7501
400 MHz
1 MB
24.5W
1.484V
0-100°C
478 µFC-PGA
RH80535GC0251M
1.6 GHz
Intel®855GME & ICH-4,855GME & 6300ESB ICH, andE7501
400 MHz
1 MB
24.5W
1.484V
0-100°C
479 µFC-BGA
RJ80535GC0251M
1.1 GHz
Intel®855GME & ICH-4,855GME & 6300ESB ICH, andE7501
400 MHz
1 MB
12W
1.180V
0-100°C
479 µFC-BGA
RJ8053LC0051M
Intel® Pentium® M Processor
CoreSpeed(GHz)
ChipsetsSupported
Front-sideBus Speed
L2Cache
ThermalDesignPower
VID
Tjunction
Package
Product Number
90nm Process Technology
2.0 GHz
Intel®915GME & ICH-6M andE7520 & E7320
533 MHz
2 MB
27W
1.260V-1.356V
0-100°C
478 µFC-PGA
RH80536GE0412M(Pentium Mprocessor 760Δ)
2.0 GHz
Intel®915GME & ICH-6M andE7520 & E7320
533 MHz
2 MB
27W
1.260V-1.356V
0-100°C
479 µFC-BGA
RJ80536GE0412M(Pentium Mprocessor 760
1.8 GHz
Intel®915GME & ICH-6M,855GME & ICH-4,855GME & 6300ESB ICH, E7501, and E7520 & E7320,Intel 3100
400 MHz
2 MB
21W
1.276V-1.340V
0-100°C
478 µFC-PGA
RH80536GC0332M(Pentium Mprocessor 745)
1.8 GHz
Intel®915GME & ICH-6M,855GME & ICH-4,855GME & 6300ESB ICH, E7501, and E7520 & E7320,Intel 3100
400 MHz
2 MB
21W
1.276V-1.340V
0-100°C
479 µFC-BGA
RJ80536GC0332M(Pentium Mprocessor 745)
1.4 GHz
Intel®915GME & ICH-6M,855GME & ICH-4,855GME & 6300ESB ICH, E7501, and E7520 & E7320,Intel 3100
400 MHz
2 MB
10W
1.116V
0-100°C
479 µFC-BGA
RJ80536LC0172M(Pentium Mprocessor LV 738)
.13µ Process Technology
1.6 GHz
Intel®855GME & ICH-4,855GME & 6300ESB ICH, andE7501
400 MHz
1 MB
24.5W
1.484V
0-100°C
478 µFC-PGA
RH80535GC0251M
1.6 GHz
Intel®855GME & ICH-4,855GME & 6300ESB ICH, andE7501
400 MHz
1 MB
24.5W
1.484V
0-100°C
479 µFC-BGA
RJ80535GC0251M
1.1 GHz
Intel®855GME & ICH-4,855GME & 6300ESB ICH, andE7501
400 MHz
1 MB
12W
1.180V
0-100°C
479 µFC-BGA
RJ8053LC0051M
Intel® Pentium® 4 Processors
Intel® Pentium® III Processor
The Pentium® III processor is ideal for high performance applied computing. It supports highend communications, transaction terminal, and industrial automation applications. While incorporating new features and improvements, the Pentium III processor remains software compatible with previous members of the Intel microprocessor family.
The Pentium III processor is validated with multiple chipsets for maximum flexibility and scalability. Combined with the Intel 840 chipset, the Pentium III processor provides high performance and bandwidth including dual processing and a second PCI bus. The 815, 815E, 810 and 440BX chipsets provide a scalable platform supporting a wide selection of Celeron® and Pentium III processors ranging from 66 to 133 MHz processor side bus speeds. The 440BX AGPset supports ECC for the highest data integrity and ISA for legacy I/O. The Intel 815, 815E and 810 chipsets utilize Intel Graphics Technology, an integrated graphics platform which provides more stability, higher quality graphics and a reduced OEM bill of materials cost.
Product Highlights
1.26 GHz 370-pin FC-PGA2 package with 512 KB Advanced Transfer Cache (on-die, full-speed L2 cache)
1 GHz, 866, 850, 733, 700 and 600 MHz, 370-pin FC-PGA package
700, 500 and 400 MHz BGA2 package
1 GHz, 866 and 733 MHz processor supports 133 MHz processor side bus
256 Kbytes Advanced Transfer Cache (on-die, full-speed L2 cache)
Compatible with Intel® 840, 815, 815E, 810E2, 810 chipsets; Intel® 82801E C-ICH; Intel® 440BX AGPset and 440MX chipset
Pentium® III processors
Product Number
Core Speed (MHz)
L2 Cache
External Bus Speed (MHz)
Thermal Design Power (Max)
Voltage
Tjunction
Package
RK80530KZ012512
1.26 GHz
512K
133
29.5W
1.45V
69C*
370FC-PGA2
RB80526PZ001256
1 GHz
256K
133
29.0W
1.75V
75C
370FC-PGA
RB80526PY001256+
1 GHz
256K
100
29.0W
1.75V
75C
370FC-PGA
RB80526PZ866256
866
256K
133
26.1W
1.75V
80C
370FC-PGA
RB80526PY850256
850
256K
100
25.7W
1.75V
80C
370FC-PGA
RB80526PZ733256
733
256K
133
22.8W
1.75V
80C
370FC-PGA
RB80526PY700256
700
256K
100
21.9W
1.75V
80C
370FC-PGA
RB80526PY600256
600
256K
100
19.6W
1.75V
82C
370FC-PGA
* Tcase, not Tjunction+ For existing embedded applications using the Intel® 440BX chipset only. Drop ship only.
Low Voltage Pentium® III processors
Product Number
Core Speed (MHz)
L2 Cache
External Bus Speed (MHz)
Thermal Design Power (Max)
Voltage
Tjunction
Package
RJ80530KZ933512**
933**
512K
133
12.2W
1.15V
0-100C
479µFCBGA
RJ80530KZ800512**
800**
512K
133
11.2W
1.15V
0-100C
479µFCBGA
** Supports dual processing when paired with third party chipsets.
Pentium® III processors - Low Power
Product Number
Core Speed (MHz)
L2 Cache
External Bus Speed (MHz)
Thermal Design Power (Max)
Voltage
Tjunction
Package
KC80526GY850256***
700***
256K
100
16.12W
1.35V
0-100C
495BGA
KC80526LY500256
500
256K
100
12.2W
1.35V
0-100C
495BGA
KC80526LY400256
400
256K
100
10.1W
1.35V
0-100C
495BGA
The Pentium® III processor is ideal for high performance applied computing. It supports highend communications, transaction terminal, and industrial automation applications. While incorporating new features and improvements, the Pentium III processor remains software compatible with previous members of the Intel microprocessor family.
The Pentium III processor is validated with multiple chipsets for maximum flexibility and scalability. Combined with the Intel 840 chipset, the Pentium III processor provides high performance and bandwidth including dual processing and a second PCI bus. The 815, 815E, 810 and 440BX chipsets provide a scalable platform supporting a wide selection of Celeron® and Pentium III processors ranging from 66 to 133 MHz processor side bus speeds. The 440BX AGPset supports ECC for the highest data integrity and ISA for legacy I/O. The Intel 815, 815E and 810 chipsets utilize Intel Graphics Technology, an integrated graphics platform which provides more stability, higher quality graphics and a reduced OEM bill of materials cost.
Product Highlights
1.26 GHz 370-pin FC-PGA2 package with 512 KB Advanced Transfer Cache (on-die, full-speed L2 cache)
1 GHz, 866, 850, 733, 700 and 600 MHz, 370-pin FC-PGA package
700, 500 and 400 MHz BGA2 package
1 GHz, 866 and 733 MHz processor supports 133 MHz processor side bus
256 Kbytes Advanced Transfer Cache (on-die, full-speed L2 cache)
Compatible with Intel® 840, 815, 815E, 810E2, 810 chipsets; Intel® 82801E C-ICH; Intel® 440BX AGPset and 440MX chipset
Pentium® III processors
Product Number
Core Speed (MHz)
L2 Cache
External Bus Speed (MHz)
Thermal Design Power (Max)
Voltage
Tjunction
Package
RK80530KZ012512
1.26 GHz
512K
133
29.5W
1.45V
69C*
370FC-PGA2
RB80526PZ001256
1 GHz
256K
133
29.0W
1.75V
75C
370FC-PGA
RB80526PY001256+
1 GHz
256K
100
29.0W
1.75V
75C
370FC-PGA
RB80526PZ866256
866
256K
133
26.1W
1.75V
80C
370FC-PGA
RB80526PY850256
850
256K
100
25.7W
1.75V
80C
370FC-PGA
RB80526PZ733256
733
256K
133
22.8W
1.75V
80C
370FC-PGA
RB80526PY700256
700
256K
100
21.9W
1.75V
80C
370FC-PGA
RB80526PY600256
600
256K
100
19.6W
1.75V
82C
370FC-PGA
* Tcase, not Tjunction+ For existing embedded applications using the Intel® 440BX chipset only. Drop ship only.
Low Voltage Pentium® III processors
Product Number
Core Speed (MHz)
L2 Cache
External Bus Speed (MHz)
Thermal Design Power (Max)
Voltage
Tjunction
Package
RJ80530KZ933512**
933**
512K
133
12.2W
1.15V
0-100C
479µFCBGA
RJ80530KZ800512**
800**
512K
133
11.2W
1.15V
0-100C
479µFCBGA
** Supports dual processing when paired with third party chipsets.
Pentium® III processors - Low Power
Product Number
Core Speed (MHz)
L2 Cache
External Bus Speed (MHz)
Thermal Design Power (Max)
Voltage
Tjunction
Package
KC80526GY850256***
700***
256K
100
16.12W
1.35V
0-100C
495BGA
KC80526LY500256
500
256K
100
12.2W
1.35V
0-100C
495BGA
KC80526LY400256
400
256K
100
10.1W
1.35V
0-100C
495BGA
Intel® Celeron® M Processor
The Intel® Celeron® M processor family is the next generation of mobile value processors, providing exceptional performance and value combined with low power for thermally sensitive embedded and communications applications. These processors offer ideal solutions for small-to-medium business and enterprise communications, storage appliances, and value-oriented embedded devices like Point Of Sale, kiosks and ATMs.
Intel® Pentium® processors with MMX™ technology
From point-of-sale (POS) terminals and retail kiosks to advanced networking equipment, Pentium® processors with MMX™ technology enable developers of embedded systems to step up to new levels of performance. To make these designs even easier and more flexible, Intel is making the performance advantages of MMX technology available at a choice of integration levels.
The upgrade path for embedded Intel® architecture includes longer life cycle support for the 200 MHz and 233 MHz Pentium processors with MMX technology.
Intel offers 166 MHz and 266 MHz Low-power Pentium processors with MMX technology. Both are available in thin HL-PBGA packaging, as well as PPGA packaging. The 166 MHz Pentium processor is also available in extended temperature range -40ºC to +115ºC.
Also, the Intel 430TX PCIset now supports synchronous DRAM [SDRAM] in embedded applications.
Product Highlights
166, 200, 233, 266 MHz
430TX PCIset
HL-PBGA, PPGA
Extended temp
New Design Options
Together the Pentium processor with MMX technology and the 430TX PCIset provides developers with flexible new options to create value-added embedded designs and upgrade existing products to new levels of performance. Regardless of which design path a developer may select, the Pentium processor with MMX technology offers performance enhancements that can be especially valuable in today's most competitive embedded application segments--including "intelligent" POS terminals, telecommunications equipment, networking devices and high-performance industrial computers.
Improve Processor Performance 10-20 Percent
Pentium processors with MMX technology can provide a 10 to 20 percent performance boost over classic Pentium processors at the same frequency. In addition, the MMX technology versions of the processor double on-chip code and data caches to 16 Kbytes and feature improved branch prediction, an enhanced pipeline and deeper write buffers for improved performance.
Advantages of Intel MMX Technology
MMX technology provides 57 new instruction sets to improve processor performance in traditional digital signal processor [DSP] applications, including the graphics, audio and voice processing capabilities now emerging as value-added features in high-performance embedded products. MMX technology can potentially eliminate the requirement for DSP chips in embedded applications such as video kiosks, telecommunications devices and POS terminals.
Intel Architecture Upgrade Path
"The Pentium processor with MMX technology offers developers the advantages of Intel's stable, long-term processor architecture, together with strong tools support, a robust development environment and a clearly defined upgrade path," notes Tom Franz, general manager of Intel's Embedded Microprocessor Division.If the flexible motherboard guidelines for split voltages were followed on the original design, Pentium Processors with MMX technology offer pin-compatibility, and a high degree of code-compatibility, with the classic Pentium processors. These compatibility features offer developers a smooth extended upgrade path from existing Intel architecture designs, together with a way to quickly add higher performance with minimal development overhead.
430TX PCIset Adds New Performance
The Intel 430TX PCIset supports synchronous DRAM [SDRAM] in embedded applications. The chipset's Ultra DMA capability allows faster downloading of larger data files in applications such as POS and industrial computers along with Concurrent PCI for smoother video and audio performance.The 430TX PCIset is also available in extended temperatures at -40°C to +85°C degrees ambient. The extended temperature Pentium processor with MMX technology, along with the extended temperature 430TX PCIset, enables an optimized solution for embedded applications.
Embedded Life Cycle Support
Intel supports the Pentium processor with MMX technology with development support and reference boards during its life cycle. Intel also has relationships with third-party vendors of development tools, services, BIOS and operating systems. A list of development tools is available at the Intel development tools web site.
Pentium® processors with MMX™ technology
Product Number
Core Speed (MHz)
External Bus Speed (MHz)
Thermal Design Power (Max)
Voltage
Tcase
Package
FV8050366200
200
66
15.7W
2.8V
0-70C
296 PPGA
FV8050366233
233
66
17.0W
2.8V
0-70C
296 PPGA
Low-power Pentium® processors with MMX™ technology
Product Number
Core Speed (MHz)
External Bus Speed (MHz)
Thermal Design Power (Max)
Voltage
Tcase
Package
FV80503CSM66166
166
66
4.5W
1.9V
0-85C
296 PPGA
FV80503CSM66266
266
66
7.6W
1.9V
0-85C
296 PPGA
GC80503CSM66166
166
66
4.1W
1.8V
0-95C
352 HL-PBGA
GC80503CSM66266
266
66
7.6W
2.0V
0-95C
352 HL-PBGA
GC80503CS166EXT
166
66
4.1W
1.8V
-40-115C
352 HL-PBGA
The upgrade path for embedded Intel® architecture includes longer life cycle support for the 200 MHz and 233 MHz Pentium processors with MMX technology.
Intel offers 166 MHz and 266 MHz Low-power Pentium processors with MMX technology. Both are available in thin HL-PBGA packaging, as well as PPGA packaging. The 166 MHz Pentium processor is also available in extended temperature range -40ºC to +115ºC.
Also, the Intel 430TX PCIset now supports synchronous DRAM [SDRAM] in embedded applications.
Product Highlights
166, 200, 233, 266 MHz
430TX PCIset
HL-PBGA, PPGA
Extended temp
New Design Options
Together the Pentium processor with MMX technology and the 430TX PCIset provides developers with flexible new options to create value-added embedded designs and upgrade existing products to new levels of performance. Regardless of which design path a developer may select, the Pentium processor with MMX technology offers performance enhancements that can be especially valuable in today's most competitive embedded application segments--including "intelligent" POS terminals, telecommunications equipment, networking devices and high-performance industrial computers.
Improve Processor Performance 10-20 Percent
Pentium processors with MMX technology can provide a 10 to 20 percent performance boost over classic Pentium processors at the same frequency. In addition, the MMX technology versions of the processor double on-chip code and data caches to 16 Kbytes and feature improved branch prediction, an enhanced pipeline and deeper write buffers for improved performance.
Advantages of Intel MMX Technology
MMX technology provides 57 new instruction sets to improve processor performance in traditional digital signal processor [DSP] applications, including the graphics, audio and voice processing capabilities now emerging as value-added features in high-performance embedded products. MMX technology can potentially eliminate the requirement for DSP chips in embedded applications such as video kiosks, telecommunications devices and POS terminals.
Intel Architecture Upgrade Path
"The Pentium processor with MMX technology offers developers the advantages of Intel's stable, long-term processor architecture, together with strong tools support, a robust development environment and a clearly defined upgrade path," notes Tom Franz, general manager of Intel's Embedded Microprocessor Division.If the flexible motherboard guidelines for split voltages were followed on the original design, Pentium Processors with MMX technology offer pin-compatibility, and a high degree of code-compatibility, with the classic Pentium processors. These compatibility features offer developers a smooth extended upgrade path from existing Intel architecture designs, together with a way to quickly add higher performance with minimal development overhead.
430TX PCIset Adds New Performance
The Intel 430TX PCIset supports synchronous DRAM [SDRAM] in embedded applications. The chipset's Ultra DMA capability allows faster downloading of larger data files in applications such as POS and industrial computers along with Concurrent PCI for smoother video and audio performance.The 430TX PCIset is also available in extended temperatures at -40°C to +85°C degrees ambient. The extended temperature Pentium processor with MMX technology, along with the extended temperature 430TX PCIset, enables an optimized solution for embedded applications.
Embedded Life Cycle Support
Intel supports the Pentium processor with MMX technology with development support and reference boards during its life cycle. Intel also has relationships with third-party vendors of development tools, services, BIOS and operating systems. A list of development tools is available at the Intel development tools web site.
Pentium® processors with MMX™ technology
Product Number
Core Speed (MHz)
External Bus Speed (MHz)
Thermal Design Power (Max)
Voltage
Tcase
Package
FV8050366200
200
66
15.7W
2.8V
0-70C
296 PPGA
FV8050366233
233
66
17.0W
2.8V
0-70C
296 PPGA
Low-power Pentium® processors with MMX™ technology
Product Number
Core Speed (MHz)
External Bus Speed (MHz)
Thermal Design Power (Max)
Voltage
Tcase
Package
FV80503CSM66166
166
66
4.5W
1.9V
0-85C
296 PPGA
FV80503CSM66266
266
66
7.6W
1.9V
0-85C
296 PPGA
GC80503CSM66166
166
66
4.1W
1.8V
0-95C
352 HL-PBGA
GC80503CSM66266
266
66
7.6W
2.0V
0-95C
352 HL-PBGA
GC80503CS166EXT
166
66
4.1W
1.8V
-40-115C
352 HL-PBGA
Intel® Celeron® Processors for Embedded Computing
With an advanced microarchitecture and core frequency of 2.0 GHz and 2.5 GHz, the Intel® Celeron® processor is ideal for scalable performance embedded computing, including communications, transaction terminal and industrial automation applications. While incorporating new features and improvements, it remains software compatible with previous members of the Intel® microprocessor family.
Intel® Celeron® Processors for Embedded Computing
Core Speed
Chipsets Supported
L2 Cache
External Bus Speed (MHz)
Thermal Design Power
Voltage
Tcase
Product Number
Package
2.5 GHz
Intel®875P,865G,852GME,845GV, and845
128KB
400
61.0W (TDP)
1.475-1.525V
72° C
RK80532RC060128
FC-PGA2 478-pin
2.0 GHz
Intel®875P,865G,852GME,845GV, and845chipsets
128KB
400
52.8W (TDP)
1.475-1.525V
68° C
RK80532RC041128
FC-PGA2 478-pin
1.66 GHz / 1.83 GHz
Intel®E7520 and3100chipsets
1MB
667
27W
1.1125V – 1.275V
100° C†
LF80538KF0281M/LF80538KF0341M
478 µFC-PGA
1.2 GHz
Intel®815E, 815, and 810E2chipsets
256KB
100
32.1W
1.5V
70° C
RK80530RY009256
370 FC-PGA2
850 MHz
Intel®815E, 815,810E2,810, and440BXchipsets
128KB
100
25.7W
1.75V
80° C†
RB80526RY850128
370 FC-PGA
733 MHz
Intel®815E, 815,810E2,810, and440BXchipsets
128KB
66
22.8W
1.75V
80° C†
RB80526RX733128
370 FC-PGA
566 MHz
Intel®815E, 815,810E2,810, and440BXchipsets
128KB
66
19.2W
1.75V
90° C†
RB80526RX566128
370 FC-PGA
433 MHz
Intel®810E2,810, and440BXchipsets
128KB
66
24.1W
2.0V
5-85° C
FV80524RX433128
370 PPGA
366 MHz
Intel®810E2,810, and440BXchipsets
128KB
66
21.7W
2.0V
5-85° C
FV80524RX366128
370 PPGA
300A MHz
Intel®810E2,810, and440BXchipsets
128KB
66
17.8W
2.0V
5-85° C
FV80524RX300128
370 PPGA
† = Tjunction, not Tcase
Intel® Celeron® D Processors for Embedded Computing
Core Speed
Chipsets Supported
L2 Cache
External Bus Speed (MHz)
Thermal Design Power
Voltage††
Tcase (Max)
Product Number
Package
3.2Ghz
Intel® 915GV, 945G, andQ965chipsets
512KB
533
65W
1.25-1.325V
69.2° C
HHS0552RE0SS512Intel® Celeron® Dprocessor 352
LGA-775
2.93 GHz
Intel®865G,915GVchipset, and Intel®945Gchipset
256KB
533
84.0W
1.25-1.4V
67.7° C
HHS0547RE077CNIntel® Celeron® Dprocessor 341Δ
LGA-775
2.8 GHz
Intel®865G,852GME,845GV,845, and845Echipsets
256KB
533
73.0W
1.25-1.4V
67° C
NES0546RE072256Intel® Celeron® Dprocessor 335Δ
µFC-PGA2 478-pin
†† Variable VID voltage. The Intel® Celeron® processor ships with different voltage settings. For detailed product specifications, please refer to the datasheet.Δ Intel processor numbers are not a measure of performance. Processor numbers differentiate features within each processor family, not across different processor families. Seehttp://www.intel.com/products/processor_number/index.htm for details.
Mobile Intel® Celeron® Processor for Embedded Computing
Core Speed
Chipsets Supported
L2 Cache
External Bus Speed (MHz)
Thermal Design Power
Voltage††
Tcase (Max)
Product Number
Package
1.2 GHz
Intel®852GMchipset
256K
400
20.8W
1.3V
0-100° C
RH80532NC009256
µFC-PGA 478
Ultra Low Voltage Intel® Celeron® Processors for Embedded Computing
Core Speed
Chipsets Supported
L2 Cache
External Bus Speed (MHz)
Thermal Design Power
Voltage††
Tcase (Max)
Product Number
Package
650 MHz
Intel®815E and440MXchipsets
256K
100
8.3W
1.1V
0-100° C
RJ80530VY650256
479 µFCBGA
400 MHz
Intel®815E and440MXchipsets
256K
100
4.2W
0.95V
0-100° C
RJ80530VY4000256
479 µFCBGA
Intel® Celeron® Processor – Low Power and Ultra Power for Embedded Computing
Core Speed
Chipsets Supported
L2 Cache
External Bus Speed (MHz)
Thermal Design Power
Voltage††
Tcase (Max)
Product Number
Package
400A MHz
Intel®440BXAGPset and440MXchipset
128K
100
10.1W
1.35V
0-100° C
KC80526LY400128
495 BGA
300 MHz
Intel®815E and440MXchipsets
128K
100
5.7W
1.1V
0-100° C
KC80526LL300128
495 BGA
Intel® Celeron® Processors for Embedded Computing
Core Speed
Chipsets Supported
L2 Cache
External Bus Speed (MHz)
Thermal Design Power
Voltage
Tcase
Product Number
Package
2.5 GHz
Intel®875P,865G,852GME,845GV, and845
128KB
400
61.0W (TDP)
1.475-1.525V
72° C
RK80532RC060128
FC-PGA2 478-pin
2.0 GHz
Intel®875P,865G,852GME,845GV, and845chipsets
128KB
400
52.8W (TDP)
1.475-1.525V
68° C
RK80532RC041128
FC-PGA2 478-pin
1.66 GHz / 1.83 GHz
Intel®E7520 and3100chipsets
1MB
667
27W
1.1125V – 1.275V
100° C†
LF80538KF0281M/LF80538KF0341M
478 µFC-PGA
1.2 GHz
Intel®815E, 815, and 810E2chipsets
256KB
100
32.1W
1.5V
70° C
RK80530RY009256
370 FC-PGA2
850 MHz
Intel®815E, 815,810E2,810, and440BXchipsets
128KB
100
25.7W
1.75V
80° C†
RB80526RY850128
370 FC-PGA
733 MHz
Intel®815E, 815,810E2,810, and440BXchipsets
128KB
66
22.8W
1.75V
80° C†
RB80526RX733128
370 FC-PGA
566 MHz
Intel®815E, 815,810E2,810, and440BXchipsets
128KB
66
19.2W
1.75V
90° C†
RB80526RX566128
370 FC-PGA
433 MHz
Intel®810E2,810, and440BXchipsets
128KB
66
24.1W
2.0V
5-85° C
FV80524RX433128
370 PPGA
366 MHz
Intel®810E2,810, and440BXchipsets
128KB
66
21.7W
2.0V
5-85° C
FV80524RX366128
370 PPGA
300A MHz
Intel®810E2,810, and440BXchipsets
128KB
66
17.8W
2.0V
5-85° C
FV80524RX300128
370 PPGA
† = Tjunction, not Tcase
Intel® Celeron® D Processors for Embedded Computing
Core Speed
Chipsets Supported
L2 Cache
External Bus Speed (MHz)
Thermal Design Power
Voltage††
Tcase (Max)
Product Number
Package
3.2Ghz
Intel® 915GV, 945G, andQ965chipsets
512KB
533
65W
1.25-1.325V
69.2° C
HHS0552RE0SS512Intel® Celeron® Dprocessor 352
LGA-775
2.93 GHz
Intel®865G,915GVchipset, and Intel®945Gchipset
256KB
533
84.0W
1.25-1.4V
67.7° C
HHS0547RE077CNIntel® Celeron® Dprocessor 341Δ
LGA-775
2.8 GHz
Intel®865G,852GME,845GV,845, and845Echipsets
256KB
533
73.0W
1.25-1.4V
67° C
NES0546RE072256Intel® Celeron® Dprocessor 335Δ
µFC-PGA2 478-pin
†† Variable VID voltage. The Intel® Celeron® processor ships with different voltage settings. For detailed product specifications, please refer to the datasheet.Δ Intel processor numbers are not a measure of performance. Processor numbers differentiate features within each processor family, not across different processor families. Seehttp://www.intel.com/products/processor_number/index.htm for details.
Mobile Intel® Celeron® Processor for Embedded Computing
Core Speed
Chipsets Supported
L2 Cache
External Bus Speed (MHz)
Thermal Design Power
Voltage††
Tcase (Max)
Product Number
Package
1.2 GHz
Intel®852GMchipset
256K
400
20.8W
1.3V
0-100° C
RH80532NC009256
µFC-PGA 478
Ultra Low Voltage Intel® Celeron® Processors for Embedded Computing
Core Speed
Chipsets Supported
L2 Cache
External Bus Speed (MHz)
Thermal Design Power
Voltage††
Tcase (Max)
Product Number
Package
650 MHz
Intel®815E and440MXchipsets
256K
100
8.3W
1.1V
0-100° C
RJ80530VY650256
479 µFCBGA
400 MHz
Intel®815E and440MXchipsets
256K
100
4.2W
0.95V
0-100° C
RJ80530VY4000256
479 µFCBGA
Intel® Celeron® Processor – Low Power and Ultra Power for Embedded Computing
Core Speed
Chipsets Supported
L2 Cache
External Bus Speed (MHz)
Thermal Design Power
Voltage††
Tcase (Max)
Product Number
Package
400A MHz
Intel®440BXAGPset and440MXchipset
128K
100
10.1W
1.35V
0-100° C
KC80526LY400128
495 BGA
300 MHz
Intel®815E and440MXchipsets
128K
100
5.7W
1.1V
0-100° C
KC80526LL300128
495 BGA
Intel® Xeon® Processor 5000/3000 Sequence
Intel® Xeon® processors for embedded computing platforms
Breakthrough performance, energy efficiency, extended lifecycle support and common socket Intel Xeon processor-based systems make them the ideal choice for compute-intensive embedded, storage and communications applications.
Lower thermal design power (TDP) and higher Tcase temperature Intel Xeon processor options are ideal options for low power consumption and/or compliance with the AdvancedTCA* form factor and NEBS level-3 thermal specifications*.
Platform configurations
These processors are validated with two different chipsets, providing a choice of flexible, dual-processor-capable platforms for a wide range of applications. These include storage area networks (SANs), network attached storage (NAS), routers, IP-PBX, converged/unified communications platforms, sophisticated content firewalls, unified threat management (UTM) systems, medical imaging equipment, military signal and image processing, and telecommunications (wireless and wireline) servers.
Intel® 5000P chipset-based platforms are ideal for full performance and memory-intense applications by providing a maximum FB-DIMM memory capacity of 64 GB, 28 lanes of PCI Express* and accelerated I/O options.
Intel® 5100 Memory Controller Hub (MCH) chipset-based platforms are ideal for bladed and dense bladed applications requiring less than 200 watts, including AdvancedTCA and NEBS-compliance.
Breakthrough performance, energy efficiency, extended lifecycle support and common socket Intel Xeon processor-based systems make them the ideal choice for compute-intensive embedded, storage and communications applications.
Lower thermal design power (TDP) and higher Tcase temperature Intel Xeon processor options are ideal options for low power consumption and/or compliance with the AdvancedTCA* form factor and NEBS level-3 thermal specifications*.
Platform configurations
These processors are validated with two different chipsets, providing a choice of flexible, dual-processor-capable platforms for a wide range of applications. These include storage area networks (SANs), network attached storage (NAS), routers, IP-PBX, converged/unified communications platforms, sophisticated content firewalls, unified threat management (UTM) systems, medical imaging equipment, military signal and image processing, and telecommunications (wireless and wireline) servers.
Intel® 5000P chipset-based platforms are ideal for full performance and memory-intense applications by providing a maximum FB-DIMM memory capacity of 64 GB, 28 lanes of PCI Express* and accelerated I/O options.
Intel® 5100 Memory Controller Hub (MCH) chipset-based platforms are ideal for bladed and dense bladed applications requiring less than 200 watts, including AdvancedTCA and NEBS-compliance.
Intel® Core™ Duo Processors for Embedded Computing
The Intel® Core™ Duo processors are members of Intel's growing product line of multi-core processors. These dual-core processors combine the benefits of two high-performance execution cores with intelligent power management features to deliver significantly greater performance-per-watt over previous Intel® processors. Intel's 65nm process technology makes it possible to integrate two cores, along with many advanced features, in one physical package.Intel Core Duo processors meet the needs of a wide range of low-power embedded applications such as interactive clients and industrial automation equipment. While incorporating advanced processor technology, they remain software-compatible with previous 32-bit Intel® architecture processors.
Product highlights
Two complete execution cores in one processor package provide advancements in simultaneous computing such as multi-threaded applications and multi-tasking environments. Dual-core processing efficiently delivers performance while balancing power requirements.Two execution cores share a high-performance, power-optimized 667 MHz front-side bus to access the same system memory. To save power, address and data buffers are turned off when there is no activity.Enhanced Intel SpeedStep® technology allows a system to dynamically adjust processor voltage and core frequency, decreasing average power consumption and average heat production.Intel® Smart Cache Design allows two execution cores to share 2 MB of L2 cache, reducing FSB traffic and enhancing system responsiveness.Fully code compatible with existing Intel Architecture-based 32-bit application software
Product highlights
Two complete execution cores in one processor package provide advancements in simultaneous computing such as multi-threaded applications and multi-tasking environments. Dual-core processing efficiently delivers performance while balancing power requirements.Two execution cores share a high-performance, power-optimized 667 MHz front-side bus to access the same system memory. To save power, address and data buffers are turned off when there is no activity.Enhanced Intel SpeedStep® technology allows a system to dynamically adjust processor voltage and core frequency, decreasing average power consumption and average heat production.Intel® Smart Cache Design allows two execution cores to share 2 MB of L2 cache, reducing FSB traffic and enhancing system responsiveness.Fully code compatible with existing Intel Architecture-based 32-bit application software
Intel® Pentium® Processor E2160 For embedded computing
The Intel® Pentium® processor delivers great performance, low power enhancements, and multitasking for embedded computing. The Intel® Pentium® processor E2160Δ with a thermal design power of 65 watts delivers energy-efficient dual-core performance for cost-sensitive embedded designs. Intel® 65nm process technology makes it possible to integrate two complete execution cores in one physical package, providing advancements in simultaneous computing for multi-threaded applications and multi-tasking environments.
This dual-core processor is well suited for a wide range of performance-intensive, low-power embedded applications in smaller form factors such as interactive clients (i.e., point-of-sale terminals and ATMs), gaming platforms, industrial control and automation, and print imaging. While incorporating advanced processor technology, these processors remain software-compatible with previous IA-32 processors.
The Intel Pentium processor E2160 is validated with the Intel® Q35 Express Chipset and Intel® Q965 Express Chipset. The Intel Q35 Express Chipset platform brings a new level of power reduction in idle and maximum power, making it an ideal choice for embedded applications meeting high-performance, low-thermal specifications.
Features and benefits
Dual-core processor
The Intel® Pentium® processor is the newest addition to the Intel® Pentium® processor family. This dual-core processor delivers high-value performance for multitasking.
Intel® 64 architectureΦ
Supports 64-bit instructions, providing flexibility for 64-bit and 32-bit applications and operating systems. Access to larger physical memory space reduces load on the system and allows faster access to data from RAM instead of the drive.
Intel® Advanced Smart Cache
Intel® Smart Cache enables smarter, more efficient cache and bus design for enhanced performance and responsiveness.
Intel® Intelligent Power Capability
Manages runtime power consumption of execution cores by turning on computing functions only when needed. Reduces overall power consumption, enabling quieter, more power-efficient system designs.
This dual-core processor is well suited for a wide range of performance-intensive, low-power embedded applications in smaller form factors such as interactive clients (i.e., point-of-sale terminals and ATMs), gaming platforms, industrial control and automation, and print imaging. While incorporating advanced processor technology, these processors remain software-compatible with previous IA-32 processors.
The Intel Pentium processor E2160 is validated with the Intel® Q35 Express Chipset and Intel® Q965 Express Chipset. The Intel Q35 Express Chipset platform brings a new level of power reduction in idle and maximum power, making it an ideal choice for embedded applications meeting high-performance, low-thermal specifications.
Features and benefits
Dual-core processor
The Intel® Pentium® processor is the newest addition to the Intel® Pentium® processor family. This dual-core processor delivers high-value performance for multitasking.
Intel® 64 architectureΦ
Supports 64-bit instructions, providing flexibility for 64-bit and 32-bit applications and operating systems. Access to larger physical memory space reduces load on the system and allows faster access to data from RAM instead of the drive.
Intel® Advanced Smart Cache
Intel® Smart Cache enables smarter, more efficient cache and bus design for enhanced performance and responsiveness.
Intel® Intelligent Power Capability
Manages runtime power consumption of execution cores by turning on computing functions only when needed. Reduces overall power consumption, enabling quieter, more power-efficient system designs.
Intel® Xeon® Processors
For Embedded Computing
The Intel® Xeon® processor is the solution for specific communication applications that require the highest levels of processing performance - such as web-serving, storage (NAS, SAN), search engines, telecommunications servers, network management, security, voice, and load balancing. When coupled with the Intel® E7500, Intel® E7501 or Intel® E7520 chipsets, the Intel Xeon processor provides high memory bandwidth, high memory capacity, and high I/O bandwidth. With 1M or 512K L2 Advanced Transfer Cache, the Intel Xeon processor along with the Intel E7500, Intel E7501 or Intel E7520 chipset creates a balanced platform that is ideal for delivering unparalleled price-performance, scalability and flexibility.
Low Voltage Intel® Xeon® Processors - The Low Voltage Intel® Xeon® processor has the added benefit of lower thermal design power making it ideal for thermally-sensitive, space-constrained environments. When coupled with the Intel E7500, Intel E7501 or the E7520 chipsets, the Low Voltage Intel Xeon processor delivers compelling value in a variety of network infrastructure applications including web-serving, search engines, telecommunications servers, network management, security, voice, and load balancing.
Intel® Xeon® Processors and Intel® Xeon® Processor with 800MHz System Bus
Core Speed (GHz)
Chipsets Supported
External Bus Speed (MHz)
L2 Cache
Thermal Design Power
Voltage
Tcase
Package
Product Number
3.2
Intel® E7520
800
1 MB
103.0W
1.2875 -1.4V**
†
604-pin FC-µPGA4
RK80546KG0881M
2.8
Intel® E7501,E7500
533
512 KB
74.0W
1.5V
75C
604-pin FC-mPGA-2p
RK80532KE072512
2.4
Intel® E7501,E7500
533
512 KB
65.0W
1.5V
74C
604-pin FC-mPGA-2p
RK80532KE056512
2.0
Intel® E7501,E7500
400
512 KB
58.0W
1.5V
70C
603-pin INT3
RN80532KC041512
† For Intel® Xeon® processor with 800MHz system bus Tcase figures, please consult the Intel® Xeon® processor with 800 MHz System Bus datasheet.** VID Range
Low Voltage Intel® Xeon® Processors and Low Voltage Intel® Xeon® Processor with 800MHz System Bus
CoreSpeed(GHz)
ChipsetsSupported
ExternalBusSpeed(MHz)
L2Cache
ThermalDesignPower
Voltage
Tcase
Package
Product Number
2.8
Intel® E7520
800
1 MB
55.0W
1.1125 -1.2V**
††
604-pin FC-µPGA4
RK80546KG0721M
2.4
Intel® E7501,E7500
533
512 KB
40.0W
1.3V
81C
604-pin FC-mPGA-2P
RK80532EE056512
2.0
Intel® E7501,E7500
400
512 KB
35.0W
1.3V
83C
604-pin FC-mPGA-2P
RK80532EC041512
1.6
Intel® E7501,E7500
400
512 KB
30.0W
1.3V
81C
604-pin FC-mPGA-2P
RK80532EC025512
The Intel® Xeon® processor is the solution for specific communication applications that require the highest levels of processing performance - such as web-serving, storage (NAS, SAN), search engines, telecommunications servers, network management, security, voice, and load balancing. When coupled with the Intel® E7500, Intel® E7501 or Intel® E7520 chipsets, the Intel Xeon processor provides high memory bandwidth, high memory capacity, and high I/O bandwidth. With 1M or 512K L2 Advanced Transfer Cache, the Intel Xeon processor along with the Intel E7500, Intel E7501 or Intel E7520 chipset creates a balanced platform that is ideal for delivering unparalleled price-performance, scalability and flexibility.
Low Voltage Intel® Xeon® Processors - The Low Voltage Intel® Xeon® processor has the added benefit of lower thermal design power making it ideal for thermally-sensitive, space-constrained environments. When coupled with the Intel E7500, Intel E7501 or the E7520 chipsets, the Low Voltage Intel Xeon processor delivers compelling value in a variety of network infrastructure applications including web-serving, search engines, telecommunications servers, network management, security, voice, and load balancing.
Intel® Xeon® Processors and Intel® Xeon® Processor with 800MHz System Bus
Core Speed (GHz)
Chipsets Supported
External Bus Speed (MHz)
L2 Cache
Thermal Design Power
Voltage
Tcase
Package
Product Number
3.2
Intel® E7520
800
1 MB
103.0W
1.2875 -1.4V**
†
604-pin FC-µPGA4
RK80546KG0881M
2.8
Intel® E7501,E7500
533
512 KB
74.0W
1.5V
75C
604-pin FC-mPGA-2p
RK80532KE072512
2.4
Intel® E7501,E7500
533
512 KB
65.0W
1.5V
74C
604-pin FC-mPGA-2p
RK80532KE056512
2.0
Intel® E7501,E7500
400
512 KB
58.0W
1.5V
70C
603-pin INT3
RN80532KC041512
† For Intel® Xeon® processor with 800MHz system bus Tcase figures, please consult the Intel® Xeon® processor with 800 MHz System Bus datasheet.** VID Range
Low Voltage Intel® Xeon® Processors and Low Voltage Intel® Xeon® Processor with 800MHz System Bus
CoreSpeed(GHz)
ChipsetsSupported
ExternalBusSpeed(MHz)
L2Cache
ThermalDesignPower
Voltage
Tcase
Package
Product Number
2.8
Intel® E7520
800
1 MB
55.0W
1.1125 -1.2V**
††
604-pin FC-µPGA4
RK80546KG0721M
2.4
Intel® E7501,E7500
533
512 KB
40.0W
1.3V
81C
604-pin FC-mPGA-2P
RK80532EE056512
2.0
Intel® E7501,E7500
400
512 KB
35.0W
1.3V
83C
604-pin FC-mPGA-2P
RK80532EC041512
1.6
Intel® E7501,E7500
400
512 KB
30.0W
1.3V
81C
604-pin FC-mPGA-2P
RK80532EC025512
Intel® IXP465 Network Processor
The Intel® IXP465 network processor is a member of the Intel® IXP46X product line for SME communications and embedded networking applications. The Intel IXP465 network processor is an addition to the Intel® IXP4XX product line of network processors, and extends Intel XScale® technology into a broad range of applications that require communications functionality. The consistency of the Intel IXP4XX product line software and hardware architecture protects customers' development investments and speeds development of a standards-based product portfolio.The highly integrated, single-chip design of the IXP465 network processor provides a unique combination of performance, reliability and flexibility. The IXP465 network processor combines Intel XScale technology with a variety of built-in communications features to support requirements for modular routers, security appliances, line cards for telecommunications infrastructure, industrial control and automation applications, interactive clients, test and instrumentation, RFID readers, and networked print imaging applications. The high-performance Intel XScale core provides processing headroom to flexibly support a broad range of OEM applications while minimizing power consumption. Integration of multiple 10/100 Ethernet interfaces and built-in hardware acceleration for time synchronization reduces overall system cost and simplifies development.
Product Highlights
Member of Intel® IXP46X product line of network processors for small-to-medium enterprise (SME) communications and embedded networking applications
Intel XScale® core speeds of up to 667 MHz provides scalable processing headroom for target applications
Built-in LAN and WAN, I2C and Synchronous Serial Port (SSP) interfaces reduce overall system cost and simplify development
Integrated support for cryptography, time synchronization and ECC memory improves performance and reliability
Consistent Intel® IXP4XX product line software and hardware architecture protects customers’ development investments and speeds deployment of a standards-based product portfolio
Robust development environment minimizes time-to-market
Features and Benefits
Intel XScale® core
Available at 266 MHz, 400 MHz, 533 MHz and 667 MHz
Delivers high MIPS/power consumption ratio and provides ample processing headroom for value-added software features
32-bit 33/66 MHz PCI v2.2, host and option interface
Provides flexibility to directly connect devices including 802.11x chips, PCMCIA controllers and cable MACs/PHYs
USB
USB v. 1.1 device controller
USB v. 2.0 host controller, supports low-speed and full-speed modes only
Industry-standard interface for connection to a wide array of devices
32-bit, DDR1-266 SDRAM interface
Optional ECC
32MByte to 1GByte of memory
High-bandwidth memory interface
Optional ECC improves system reliability
32-bit Expansion bus interface with parity
Master/Target capable
25-bit address
Glueless connection to most other devices
External mastering capability allows external devices to communicate with each other and with internal peripherals resulting in shared memory subsystem design and lower system cost>
Integrated Ethernet MACs
Up to three integrated 10/100 Ethernet MACs with SMII interface
Up to three integrated 10/100 Ethernet MACs with MII interface
Industry-standard networking interface lowers system bill of materials (BOM) cost
Multiple ports allow:
Lower system cost
Multiple LAN port support
Concatenation of networking modules
UTOPIA-2 Interface with multiple ADSL/G.SHDSL or VDSL PHY support
Industry standard WAN interface
Two high-speed serial (HSS) ports for connecting to T1/E1 or SLIC/CODECs
Connects to T1/E1 or SLIC/CODECs for voice support
Silicon functional assistance for Random Number Generation
Accelerates public key exchange and authentication and key generation
Integrated hardware support for popular cryptography algorithms
Acceleration for popular applications such as IPSec and SSL VPNs (AES/AES-CCM/3DES/DES/SHA-1/SHA-256/ SHA-384/SHA-512/MD-5/RSA/DSA/Diffie-Hellman algorithms)
Hardware support for IEEE1588 protocol
Hardware assistance for Time Synchronization in a distributed control system containing multiple clocks
Two high-speed UARTs support up to 921Kbaud each
Provides an interface for debug and passing control information
Integrated I2C and SSP interfaces
Provides serial interfaces for common embedded and communications application: reduces system BOM cost
Spread spectrum clocking
Improves system reliability by reducing EMI
Comprehensive pre-validated pre-integrated "out-of-the-box" development infrastructures ready for application development using Linux*, VxWorks*
Ease of design and fast time-to-market
544-Ball PBGA Package
35mm x 35mm, 1.27mm ball pitch
Lead-free packages available
Commercial temperature (0° to 70° C)
Extended temperature (-40° to 85° C)
High-performance package provides improved reliability
Lead-free packages help to meet environmental regulations
Extended temperature support for industrial control and automation applications
Product Highlights
Member of Intel® IXP46X product line of network processors for small-to-medium enterprise (SME) communications and embedded networking applications
Intel XScale® core speeds of up to 667 MHz provides scalable processing headroom for target applications
Built-in LAN and WAN, I2C and Synchronous Serial Port (SSP) interfaces reduce overall system cost and simplify development
Integrated support for cryptography, time synchronization and ECC memory improves performance and reliability
Consistent Intel® IXP4XX product line software and hardware architecture protects customers’ development investments and speeds deployment of a standards-based product portfolio
Robust development environment minimizes time-to-market
Features and Benefits
Intel XScale® core
Available at 266 MHz, 400 MHz, 533 MHz and 667 MHz
Delivers high MIPS/power consumption ratio and provides ample processing headroom for value-added software features
32-bit 33/66 MHz PCI v2.2, host and option interface
Provides flexibility to directly connect devices including 802.11x chips, PCMCIA controllers and cable MACs/PHYs
USB
USB v. 1.1 device controller
USB v. 2.0 host controller, supports low-speed and full-speed modes only
Industry-standard interface for connection to a wide array of devices
32-bit, DDR1-266 SDRAM interface
Optional ECC
32MByte to 1GByte of memory
High-bandwidth memory interface
Optional ECC improves system reliability
32-bit Expansion bus interface with parity
Master/Target capable
25-bit address
Glueless connection to most other devices
External mastering capability allows external devices to communicate with each other and with internal peripherals resulting in shared memory subsystem design and lower system cost>
Integrated Ethernet MACs
Up to three integrated 10/100 Ethernet MACs with SMII interface
Up to three integrated 10/100 Ethernet MACs with MII interface
Industry-standard networking interface lowers system bill of materials (BOM) cost
Multiple ports allow:
Lower system cost
Multiple LAN port support
Concatenation of networking modules
UTOPIA-2 Interface with multiple ADSL/G.SHDSL or VDSL PHY support
Industry standard WAN interface
Two high-speed serial (HSS) ports for connecting to T1/E1 or SLIC/CODECs
Connects to T1/E1 or SLIC/CODECs for voice support
Silicon functional assistance for Random Number Generation
Accelerates public key exchange and authentication and key generation
Integrated hardware support for popular cryptography algorithms
Acceleration for popular applications such as IPSec and SSL VPNs (AES/AES-CCM/3DES/DES/SHA-1/SHA-256/ SHA-384/SHA-512/MD-5/RSA/DSA/Diffie-Hellman algorithms)
Hardware support for IEEE1588 protocol
Hardware assistance for Time Synchronization in a distributed control system containing multiple clocks
Two high-speed UARTs support up to 921Kbaud each
Provides an interface for debug and passing control information
Integrated I2C and SSP interfaces
Provides serial interfaces for common embedded and communications application: reduces system BOM cost
Spread spectrum clocking
Improves system reliability by reducing EMI
Comprehensive pre-validated pre-integrated "out-of-the-box" development infrastructures ready for application development using Linux*, VxWorks*
Ease of design and fast time-to-market
544-Ball PBGA Package
35mm x 35mm, 1.27mm ball pitch
Lead-free packages available
Commercial temperature (0° to 70° C)
Extended temperature (-40° to 85° C)
High-performance package provides improved reliability
Lead-free packages help to meet environmental regulations
Extended temperature support for industrial control and automation applications
Intel® IXP2855 Network Processor
As communications networks continue to evolve, service providers are eager to take advantage of emerging capabilities to offer new value-added services to their customers while, at the same time, closely manage the costs incurred for these upgrades.The Intel® IXP2855 network processor delivers high-performance packet and content processing with robust security features in a single chip. By integrating capabilities that have typically required multiple specialized processors, the Intel IXP2855 provides a cost-effective, security-enabled platform for a broad range of emerging applications.
Product Highlights
Packet and content processing with robust security features in a single component reduces system cost by eliminating need for multiple devices
Integrated cryptography engines provide hardware acceleration of multiple algorithms-including DES, 3DES, AES, and SHA-1-performing IPSec encryption/decryption up to 10 Gbps
Fully programmable, flexible network processor architecture enables optimization of additional algorithms and protocols to support IPSec, TCP, and SSL application environments
Cryptography engines support interleaving and processing of frames "on-the-fly" to enable processing of protected content for multi-Gigabit streams or single 10 Gbps connections
Integrated design helps minimize board real estate, power and memory requirements
Software- and pin-compatible with Intel® IXP28XX product line of network processors, preserving customer investments and enabling evolution of current IXP28XX-based boards and systems
Software building blocks, application kits, and specialized support services help to reduce development efforts and speed time-to-market
Consistent development environment provides a comprehensive set of simulation, profiling, and debugging capabilities for faster prototyping
IPSec/TCP termination and off-load functionality in networked storage applications
Content-aware load balancing in networked appliances, such as web switches, intrusion detection systems, and firewalls.
Product Highlights
Packet and content processing with robust security features in a single component reduces system cost by eliminating need for multiple devices
Integrated cryptography engines provide hardware acceleration of multiple algorithms-including DES, 3DES, AES, and SHA-1-performing IPSec encryption/decryption up to 10 Gbps
Fully programmable, flexible network processor architecture enables optimization of additional algorithms and protocols to support IPSec, TCP, and SSL application environments
Cryptography engines support interleaving and processing of frames "on-the-fly" to enable processing of protected content for multi-Gigabit streams or single 10 Gbps connections
Integrated design helps minimize board real estate, power and memory requirements
Software- and pin-compatible with Intel® IXP28XX product line of network processors, preserving customer investments and enabling evolution of current IXP28XX-based boards and systems
Software building blocks, application kits, and specialized support services help to reduce development efforts and speed time-to-market
Consistent development environment provides a comprehensive set of simulation, profiling, and debugging capabilities for faster prototyping
IPSec/TCP termination and off-load functionality in networked storage applications
Content-aware load balancing in networked appliances, such as web switches, intrusion detection systems, and firewalls.
Intel® IXP2805 Network Processor
The Intel® IXP2805 network processor is footprint- and pin compatible with the Intel® IXP28XX product line of network processors, allowing customers an easy migration path for new designs that require higher performance and lower power. The Intel IXP2805 is a highly flexible and programmable network processor with a high-performance parallel processing architecture for processing complex Layer 2 through Layer 7 algorithms, deep packet inspection and filtering, traffic management, and forwarding at wire speed. The Intel IXP2805 network processor is supported by a comprehensive development environment including a common set of development tools, libraries, and example designs that can help accelerate time-to-market and enable the addition of new and evolving services to customer applications.
Product Highlights
Low-power/high-performance solution for a broad range of Layer 2 through Layer 7 applications
Up to 10 Gbps packet forwarding, policing, scheduling, queue management, and protocol inter-working
16 fully programmable multi-threaded microengines support 25 Giga-operations per second
High-performance, low-power 32-bit Intel XScale® core for processing complex algorithms, route table maintenance, and control plane and system-level management functions
64-million enqueue/dequeue packet operations per second, enabling deep packet processing of minimum 49-byte Packet-Over-SONET (POS) packets with no loss of performance
Software- and pin-compatible with the Intel® IXP28XX product line of network processors, preserving customer investments and enabling evolution of current IXP28XX-based boards and systems
Industry-standard Advanced Telecom Computing Architecture*-based (AdvancedTCA*) hardware development platform for rapid product development and prototyping
Product Highlights
Low-power/high-performance solution for a broad range of Layer 2 through Layer 7 applications
Up to 10 Gbps packet forwarding, policing, scheduling, queue management, and protocol inter-working
16 fully programmable multi-threaded microengines support 25 Giga-operations per second
High-performance, low-power 32-bit Intel XScale® core for processing complex algorithms, route table maintenance, and control plane and system-level management functions
64-million enqueue/dequeue packet operations per second, enabling deep packet processing of minimum 49-byte Packet-Over-SONET (POS) packets with no loss of performance
Software- and pin-compatible with the Intel® IXP28XX product line of network processors, preserving customer investments and enabling evolution of current IXP28XX-based boards and systems
Industry-standard Advanced Telecom Computing Architecture*-based (AdvancedTCA*) hardware development platform for rapid product development and prototyping
Intel® IXP2400 Network Processor
Intel's second-generation network processors are the first implementation of Intel's Hyper Task Chaining technology. This unique network processing approach allows a single stream packet/cell processing problem to be decomposed into multiple, sequential tasks that can be easily linked together. The hardware design uses fast and flexible sharing of data and event signals among threads and microengines to manage data-dependent operations among multiple parallel processing stages with low latency. Through this combination of flexible software pipelining and fast inter-process communication, Hyper Task Chaining delivers rich processing capability at OC-48/2.5 Gbps line rates.The Intel® IXP2400 network processor is a member of Intel's second-generation network processor family. It is designed for a wide range of access and edge applications including multi-service switches, routers, broadband access devices and wireless infrastructure systems. Based on the first-generation Intel® IXP1200 network processor, the IXP2400 is a fully programmable network processor that implements a high-performance parallel processing architecture on a single chip for processing complex algorithms, deep packet inspection, traffic management and forwarding at wire speed. Its store-and-forward architecture combines a high-performance Intel XScale® core with eight 32-bit independent multi-threaded microengines that cumulatively provide more than 5.4 giga-operations per second. The microengines provide the processing power to perform tasks that traditionally required expensive high-speed ASICs.
Features and Benefits
8 integrated programmable microengines with 4K instruction program stores
Enhanced second-generation flexible multi-threaded RISC processors that can be programmed to deliver intelligent transmit and receive processing, with robust software development environment for rapid product development
Integrated Intel XScale Core- 32 Kbyte – Instruction cache- 32 Kbyte – Data cache- 2 Kbyte – Mini-data cache
Embedded 32-bit RISC core for high performance processing of complex algorithms, route table maintenance and system-level management functions. Lowers system cost and saves board space
2 unidirectional 32-bit media interfaces (Rx and Tx) programmable to be SPI-3, UTOPIA 1/2/3 or CSIX-L1. Each path is configurable for 4x8-bit, 2x16bit, 1x32bit or combinations of 8 & 16 bit data paths.
Supports industry standard cell and packet Interfaces to media and fabric devices delivering 4 Gbps performance rates that can support OC-48 plus fabric encapsulation overhead or 4 x GbE; simplifies design and interface to custom ASIC devices
1 industry-standard DDR DRAM interface
Memory subsystem supports the network processor store-and-forward processing model
2 industry-standard QDR SRAM interface
Memory subsystem for look-up tables and access lists, or co-processors (such as CAM/TCAM, IPsec devices). NPF standardized interface for co-processors
PCI 2.2 64 bit/66 MHz I/O Interface
Supports industry-standard connection to system host processors
Asynchronous control interface supports 8, 16 or 32 bit slow port devices
Provides control interface for connecting to maintenance port of PHY devices and flash memory
Hardware support for memory access queuing
Simplifies product development and reduces system cost
JTAG support
Improve hardware debug ability
Software SDK
Improves time to market via robust hardware and software development tools
Hardware Development Platform
Improves time to market via robust hardware and software development tools
Additional integrated hardware features:- Hardware Hash Unit (48, 64 and 128 bit)- 16 KByte Scratchpad Memory- Serial UART port for debug- 4 general-purpose I/O pins- 4 32-bit timers
Simplifies development, reduces development cost and saves board space
Features and Benefits
8 integrated programmable microengines with 4K instruction program stores
Enhanced second-generation flexible multi-threaded RISC processors that can be programmed to deliver intelligent transmit and receive processing, with robust software development environment for rapid product development
Integrated Intel XScale Core- 32 Kbyte – Instruction cache- 32 Kbyte – Data cache- 2 Kbyte – Mini-data cache
Embedded 32-bit RISC core for high performance processing of complex algorithms, route table maintenance and system-level management functions. Lowers system cost and saves board space
2 unidirectional 32-bit media interfaces (Rx and Tx) programmable to be SPI-3, UTOPIA 1/2/3 or CSIX-L1. Each path is configurable for 4x8-bit, 2x16bit, 1x32bit or combinations of 8 & 16 bit data paths.
Supports industry standard cell and packet Interfaces to media and fabric devices delivering 4 Gbps performance rates that can support OC-48 plus fabric encapsulation overhead or 4 x GbE; simplifies design and interface to custom ASIC devices
1 industry-standard DDR DRAM interface
Memory subsystem supports the network processor store-and-forward processing model
2 industry-standard QDR SRAM interface
Memory subsystem for look-up tables and access lists, or co-processors (such as CAM/TCAM, IPsec devices). NPF standardized interface for co-processors
PCI 2.2 64 bit/66 MHz I/O Interface
Supports industry-standard connection to system host processors
Asynchronous control interface supports 8, 16 or 32 bit slow port devices
Provides control interface for connecting to maintenance port of PHY devices and flash memory
Hardware support for memory access queuing
Simplifies product development and reduces system cost
JTAG support
Improve hardware debug ability
Software SDK
Improves time to market via robust hardware and software development tools
Hardware Development Platform
Improves time to market via robust hardware and software development tools
Additional integrated hardware features:- Hardware Hash Unit (48, 64 and 128 bit)- 16 KByte Scratchpad Memory- Serial UART port for debug- 4 general-purpose I/O pins- 4 32-bit timers
Simplifies development, reduces development cost and saves board space
Intel® IXP2350 Network Processor
Enables Access and Edge Applications to 2 Gbps
The Intel® IXP2350 network processor extends Intel's fully programmable architecture to new, lower cost/performance points for access and edge applications, including broadband access devices, wireless infrastructure systems, routers and multi-service switches.To meet today's and tomorrow's demanding dataplane performance requirements, the IXP2350 network processor provides a powerful, integrated control plane processor in the same chip. The high-speed core (up to 1.2 GHz) incorporates advanced I/O and memory features, enabling customers to eliminate an external control plane processor in many applications. Additional hardware-assisted features in the IXP2350 network processor increase performance and simplify development.
Features and benefits
Four integrated programmable microengines (MEv2) with 8K instruction program stores running up to 900 MHz
Flexible multi-threaded RISC processors can be programmed to deliver intelligent transmit and receive processing, with robust software development environment for rapid product development
Integrated Intel XScale® core:
32 Kbytes - Instruction cache
32 Kbytes - Data cache
Up to 1,200 MHz
Embedded 32-bit RISC core for high performance processing of complex algorithms, route table maintenance and system-level management functions. Lowers system cost by eliminating external host processor.
Integrated 512 Kbytes L2 push cache performance
Improves CPU performance and MEv2 to Intel XScale core and PCI to Intel XScale core communication
Two unidirectional 32-bit media interfaces (Rx and Tx) programmable as SPI-3 or UTOPIAEach path configurable for 4x8-bit, 2x16-bit, 1x32-bit or combinations of 8 & 16-bit data paths
Supports industry standard cell and packet interfaces to media and fabric devices; simplifies design and interface to custom ASIC devicesSupports up to 127 ports using a 16-bit UTOPIA-2 MPHY mode
Two integrated Gigabit Ethernet MACs
Lowers system cost, power and board real estate
Two integrated 10/100 Ethernet MACs
Can be used as debugging ports or control signal ports. Lowers system cost, power and board real estate.
Integrated high speed serial controller:
256 HDLC channel controller(64 channels when configured with dynamic timeslot remap)
ATM-TC
Up to 16xT1/E1/J1 TDM links
Performs inverse multiplexing over ATM (IMA), which provides lower system cost, power and board real estate
Integrated cryptography accelerator
Provides up to 200 Mbps bulk encryption (DES/SHA-1) capability. Supports AES, DES and 3DES encryption algorithms as well as SHA-1 and MD5 hashing algorithms.
Two industry standard DDR DRAM interfaces:
One 64-bit + ECC DDR300 low latency channel (up to 2GB) optimized for microengine use (not available on 300 MHz ME configuration)
One 32-bit + ECC DDR300 low latency channel (up to 1GB) optimized for the Intel XScale core
Memory subsystem supports the network processor store-and-forward processing model. Separate memory channels for Intel XScale core and microengines improves data plane and control plane performance.
I/O coherency for Intel XScale core DRAM
Improves performance through accelerated control plane/data plane communications
One industry standard QDR SRAM interface (not available on 300 MHz ME configuration)
Provides industry standard interface for memory subsystem for look-up tables and access lists, or co-processors (such as CAM/TCAM)
Asynchronous control interface supports 8 or 16-bit slow port devices via 16-bit expansion bus
Provides control interface for connecting to microprocessor port of PHY devices and flash memory. Provides a direct connection to DSP via HPI.
Hardware support for memory access queuing
Simplifies application development and reduces system cost
JTAG support
Improves hardware debug ability
Intel® IXA Software Development Kit (SDK) Intel® Hardware Development Platform
Industry standard AdvancedTCA* form factor hardware reference design and state of the art development tools improves time to market via robust hardware and software development tools
1752 ball FCBGA 42.5 mm x 42.5 mm package
Minimizes board layers, providing easier board layer routing and lower cost
The Intel® IXP2350 network processor extends Intel's fully programmable architecture to new, lower cost/performance points for access and edge applications, including broadband access devices, wireless infrastructure systems, routers and multi-service switches.To meet today's and tomorrow's demanding dataplane performance requirements, the IXP2350 network processor provides a powerful, integrated control plane processor in the same chip. The high-speed core (up to 1.2 GHz) incorporates advanced I/O and memory features, enabling customers to eliminate an external control plane processor in many applications. Additional hardware-assisted features in the IXP2350 network processor increase performance and simplify development.
Features and benefits
Four integrated programmable microengines (MEv2) with 8K instruction program stores running up to 900 MHz
Flexible multi-threaded RISC processors can be programmed to deliver intelligent transmit and receive processing, with robust software development environment for rapid product development
Integrated Intel XScale® core:
32 Kbytes - Instruction cache
32 Kbytes - Data cache
Up to 1,200 MHz
Embedded 32-bit RISC core for high performance processing of complex algorithms, route table maintenance and system-level management functions. Lowers system cost by eliminating external host processor.
Integrated 512 Kbytes L2 push cache performance
Improves CPU performance and MEv2 to Intel XScale core and PCI to Intel XScale core communication
Two unidirectional 32-bit media interfaces (Rx and Tx) programmable as SPI-3 or UTOPIAEach path configurable for 4x8-bit, 2x16-bit, 1x32-bit or combinations of 8 & 16-bit data paths
Supports industry standard cell and packet interfaces to media and fabric devices; simplifies design and interface to custom ASIC devicesSupports up to 127 ports using a 16-bit UTOPIA-2 MPHY mode
Two integrated Gigabit Ethernet MACs
Lowers system cost, power and board real estate
Two integrated 10/100 Ethernet MACs
Can be used as debugging ports or control signal ports. Lowers system cost, power and board real estate.
Integrated high speed serial controller:
256 HDLC channel controller(64 channels when configured with dynamic timeslot remap)
ATM-TC
Up to 16xT1/E1/J1 TDM links
Performs inverse multiplexing over ATM (IMA), which provides lower system cost, power and board real estate
Integrated cryptography accelerator
Provides up to 200 Mbps bulk encryption (DES/SHA-1) capability. Supports AES, DES and 3DES encryption algorithms as well as SHA-1 and MD5 hashing algorithms.
Two industry standard DDR DRAM interfaces:
One 64-bit + ECC DDR300 low latency channel (up to 2GB) optimized for microengine use (not available on 300 MHz ME configuration)
One 32-bit + ECC DDR300 low latency channel (up to 1GB) optimized for the Intel XScale core
Memory subsystem supports the network processor store-and-forward processing model. Separate memory channels for Intel XScale core and microengines improves data plane and control plane performance.
I/O coherency for Intel XScale core DRAM
Improves performance through accelerated control plane/data plane communications
One industry standard QDR SRAM interface (not available on 300 MHz ME configuration)
Provides industry standard interface for memory subsystem for look-up tables and access lists, or co-processors (such as CAM/TCAM)
Asynchronous control interface supports 8 or 16-bit slow port devices via 16-bit expansion bus
Provides control interface for connecting to microprocessor port of PHY devices and flash memory. Provides a direct connection to DSP via HPI.
Hardware support for memory access queuing
Simplifies application development and reduces system cost
JTAG support
Improves hardware debug ability
Intel® IXA Software Development Kit (SDK) Intel® Hardware Development Platform
Industry standard AdvancedTCA* form factor hardware reference design and state of the art development tools improves time to market via robust hardware and software development tools
1752 ball FCBGA 42.5 mm x 42.5 mm package
Minimizes board layers, providing easier board layer routing and lower cost
Intel® IXP2325 Network Processor
Enables Access and Edge Applications to 1 Gbps
The Intel® IXP2325 network processor extends Intel's fully programmable architecture to new, lower cost/performance points for access and edge applications, including broadband access devices, wireless infrastructure systems, routers and multi-service switches.To meet today's and tomorrow's demanding dataplane performance requirements, the IXP2325 network processor provides a powerful, integrated control plane processor in the same chip. The high-speed core (900 MHz) incorporates advanced I/O and memory features, enabling customers to eliminate an external control plane processor in many applications. Additional hardware-assisted features in the IXP2325 network processor increase performance and simplify development.
Features and benefits
Two integrated programmable microengines (MEv2) with 8K instruction program stores running at 600 MHz
Flexible multi-threaded RISC processors can be programmed to deliver intelligent transmit and receive processing, with robust software development environment for rapid product development
Integrated Intel XScale® core:
32 Kbytes - Instruction cache
32 Kbytes - Data cache
At 900 MHz
Embedded 32-bit RISC core for high performance processing of complex algorithms, route table maintenance and system-level management functions. Lowers system cost by eliminating external host processor.
Integrated 512 Kbytes L2 push cache performance
Improves CPU performance and MEv2 to Intel XScale core and PCI to Intel XScale core communication
Two unidirectional 32-bit media interfaces (Rx and Tx) programmable as SPI-3 or UTOPIAEach path configurable for 4x8-bit, 2x16-bit, 1x32-bit or combinations of 8- & 16-bit data paths
Supports industry standard cell and packet interfaces to media and fabric devices; simplifies design and interface to custom ASIC devicesSupports up to 127 ports using a 16-bit UTOPIA-2 MPHY mode
Two integrated Gigabit Ethernet MACs
Lowers system cost, power and board real estate
Two integrated 10/100 Ethernet MACs
Can be used as debugging ports or control signal ports. Lowers system cost, power and board real estate.
Integrated high speed serial controller:
256 HDLC channel controller(64 channels when configured with dynamic timeslot remap)
ATM-TC
Up to 16xT1/E1/J1 TDM links
Performs inverse multiplexing over ATM (IMA), which provides lower system cost, power and board real estate
Integrated cryptography accelerator
Provides up to 200 Mbps bulk encryption (DES/SHA-1) capability. Supports AES, DES and 3DES encryption algorithms as well as SHA-1 and MD5 hashing algorithms.
Two industry standard DDR DRAM interfaces:
One 64-bit + ECC DDR300 low latency channel (up to 2GB) optimized for microengine use
One 32-bit + ECC DDR300 low latency channel (up to 1GB) optimized for the Intel XScale core
Memory subsystem supports the network processor store-and-forward processing model. Separate memory channels for Intel XScale core and microengines improves data plane and control plane performance.
I/O coherency for Intel XScale core DRAM
Improves performance through accelerated control plane/data plane communications
One industry standard QDR SRAM interface
Provides industry standard interface for memory subsystem for look-up tables and access lists, or co-processors (such as CAM/TCAM)
Asynchronous control interface supports 8- or 16-bit slow port devices via 16-bit expansion bus
Provides control interface for connecting to microprocessor port of PHY devices and flash memory. Provides a direct connection to DSP via HPI.
Hardware support for memory access queuing
Simplifies application development and reduces system cost
JTAG support
Improves hardware debug ability
Intel® IXA Software Development Kit (SDK)Intel® Hardware Development Platform
Industry standard AdvancedTCA* form factor hardware reference design and state of the art development tools improves time to market via robust hardware and software development tools
1752 ball FCBGA 42.5 mm x 42.5 mm package
Minimizes board layers, providing easier board layer routing and lower cost
The Intel® IXP2325 network processor extends Intel's fully programmable architecture to new, lower cost/performance points for access and edge applications, including broadband access devices, wireless infrastructure systems, routers and multi-service switches.To meet today's and tomorrow's demanding dataplane performance requirements, the IXP2325 network processor provides a powerful, integrated control plane processor in the same chip. The high-speed core (900 MHz) incorporates advanced I/O and memory features, enabling customers to eliminate an external control plane processor in many applications. Additional hardware-assisted features in the IXP2325 network processor increase performance and simplify development.
Features and benefits
Two integrated programmable microengines (MEv2) with 8K instruction program stores running at 600 MHz
Flexible multi-threaded RISC processors can be programmed to deliver intelligent transmit and receive processing, with robust software development environment for rapid product development
Integrated Intel XScale® core:
32 Kbytes - Instruction cache
32 Kbytes - Data cache
At 900 MHz
Embedded 32-bit RISC core for high performance processing of complex algorithms, route table maintenance and system-level management functions. Lowers system cost by eliminating external host processor.
Integrated 512 Kbytes L2 push cache performance
Improves CPU performance and MEv2 to Intel XScale core and PCI to Intel XScale core communication
Two unidirectional 32-bit media interfaces (Rx and Tx) programmable as SPI-3 or UTOPIAEach path configurable for 4x8-bit, 2x16-bit, 1x32-bit or combinations of 8- & 16-bit data paths
Supports industry standard cell and packet interfaces to media and fabric devices; simplifies design and interface to custom ASIC devicesSupports up to 127 ports using a 16-bit UTOPIA-2 MPHY mode
Two integrated Gigabit Ethernet MACs
Lowers system cost, power and board real estate
Two integrated 10/100 Ethernet MACs
Can be used as debugging ports or control signal ports. Lowers system cost, power and board real estate.
Integrated high speed serial controller:
256 HDLC channel controller(64 channels when configured with dynamic timeslot remap)
ATM-TC
Up to 16xT1/E1/J1 TDM links
Performs inverse multiplexing over ATM (IMA), which provides lower system cost, power and board real estate
Integrated cryptography accelerator
Provides up to 200 Mbps bulk encryption (DES/SHA-1) capability. Supports AES, DES and 3DES encryption algorithms as well as SHA-1 and MD5 hashing algorithms.
Two industry standard DDR DRAM interfaces:
One 64-bit + ECC DDR300 low latency channel (up to 2GB) optimized for microengine use
One 32-bit + ECC DDR300 low latency channel (up to 1GB) optimized for the Intel XScale core
Memory subsystem supports the network processor store-and-forward processing model. Separate memory channels for Intel XScale core and microengines improves data plane and control plane performance.
I/O coherency for Intel XScale core DRAM
Improves performance through accelerated control plane/data plane communications
One industry standard QDR SRAM interface
Provides industry standard interface for memory subsystem for look-up tables and access lists, or co-processors (such as CAM/TCAM)
Asynchronous control interface supports 8- or 16-bit slow port devices via 16-bit expansion bus
Provides control interface for connecting to microprocessor port of PHY devices and flash memory. Provides a direct connection to DSP via HPI.
Hardware support for memory access queuing
Simplifies application development and reduces system cost
JTAG support
Improves hardware debug ability
Intel® IXA Software Development Kit (SDK)Intel® Hardware Development Platform
Industry standard AdvancedTCA* form factor hardware reference design and state of the art development tools improves time to market via robust hardware and software development tools
1752 ball FCBGA 42.5 mm x 42.5 mm package
Minimizes board layers, providing easier board layer routing and lower cost
Intel® IXDP2805 and Intel® IXDP2855 Advanced Development Platforms
Equipment designed for network access, edge, and enterprise applications requires robust network processing performance to support value-added network services at line rate. Quick implementation of new network services is a primary objective. To be competitive, however, vendors of network equipment must also minimize their development time and cost. To support these requirements, network processors need to combine high performance with flexible control of processing resources.The Intel IXP2805 and IXP2855 network processors are designed to provide these capabilities through a fully programmable, parallel processing architecture on a single chip. They handle complex algorithms and perform deep packet inspection, traffic management, and forwarding at speeds up to 10 Gbps. In addition, the IXP2855 network processor has integrated cryptography engines that enable implementation of security features, eliminating the need for an additional specialized processor.
Development Platforms Based on Design Requirements
Intel® IXDP2805/IXDP2855 Advanced Development Platforms
Standards-based, PICMG 3.0 Advanced Telecom Computing Architecture* (AdvancedTCA*) compliant single-chip implementations ideal for designing access and edge applications spanning OC-3 to OC-48/4GbE line rates, such as an OC-48 router.
Product Highlights
Single-chip implementations, ideal for designing applications spanning OC-3 to OC-48/GbE line rates, such as security appliances, enterprise and edge switches, and 3G RNC data planes
Support for Intel IXP2805 and IXP2855 network processors at 1.4 GHz, 1.0 GHz, and 650 MHz
Standards-based, PICMG 3.0 Advanced Telecom Computing Architecture* (AdvancedTCA*)-compliant
Modular platform architecture, including chassis, boards, and optional mezzanine cards for flexible I/O configurations and dataflow emulation
Developers can emulate, optimize, and debug advanced networking products
Rapid prototyping of an entire application with complete development environment, including hardware, development tools, and applications software
Hardware and application software can be developed simultaneously to accelerate time to market
Off-the-shelf PCI Mezzanine Card (PMC) can be added to enable simultaneous data plane and control plane development
Facilitates integration of complementary hardware and software from third parties
Product Names
Intel® IXDP2805 and IXDP2855 Advanced Development Platforms
Intel® IXDP2805 Advanced Development Platform (ATCA) (includes Intel® IXMB2805 Single Network Processor Base Card, PICMG3.0 compliant 5-slot AdvancedTCA chassis, Shelf Manager, and 1200W external power supply)Intel® IXDP2855 Advanced Development Platform (ATCA) (includes Intel® IXMB2855 Single Network Processor Base Card, PICMG3.0 compliant 5-slot AdvancedTCA chassis, Shelf Manager, and 1200W external power supply)
Base Card
Intel® IXMB2805 Single Network Processor Base Card (ATCA) Intel® IXMB2855 Single Network Processor Base Card (ATCA)
Option Cards
Intel® IXD4OC12T1F Quad OC-3/OC-12 I/O Option CardIntel® IXD1OC48T1F Single OC-48 I/O Option CardIntel® IXD4GETOC Quad Gigabit Ethernet I/O Option CardIntel® IXQDR2416 16MB QDR-II SRAM Memory Module Option Card
Development Platforms Based on Design Requirements
Intel® IXDP2805/IXDP2855 Advanced Development Platforms
Standards-based, PICMG 3.0 Advanced Telecom Computing Architecture* (AdvancedTCA*) compliant single-chip implementations ideal for designing access and edge applications spanning OC-3 to OC-48/4GbE line rates, such as an OC-48 router.
Product Highlights
Single-chip implementations, ideal for designing applications spanning OC-3 to OC-48/GbE line rates, such as security appliances, enterprise and edge switches, and 3G RNC data planes
Support for Intel IXP2805 and IXP2855 network processors at 1.4 GHz, 1.0 GHz, and 650 MHz
Standards-based, PICMG 3.0 Advanced Telecom Computing Architecture* (AdvancedTCA*)-compliant
Modular platform architecture, including chassis, boards, and optional mezzanine cards for flexible I/O configurations and dataflow emulation
Developers can emulate, optimize, and debug advanced networking products
Rapid prototyping of an entire application with complete development environment, including hardware, development tools, and applications software
Hardware and application software can be developed simultaneously to accelerate time to market
Off-the-shelf PCI Mezzanine Card (PMC) can be added to enable simultaneous data plane and control plane development
Facilitates integration of complementary hardware and software from third parties
Product Names
Intel® IXDP2805 and IXDP2855 Advanced Development Platforms
Intel® IXDP2805 Advanced Development Platform (ATCA) (includes Intel® IXMB2805 Single Network Processor Base Card, PICMG3.0 compliant 5-slot AdvancedTCA chassis, Shelf Manager, and 1200W external power supply)Intel® IXDP2855 Advanced Development Platform (ATCA) (includes Intel® IXMB2855 Single Network Processor Base Card, PICMG3.0 compliant 5-slot AdvancedTCA chassis, Shelf Manager, and 1200W external power supply)
Base Card
Intel® IXMB2805 Single Network Processor Base Card (ATCA) Intel® IXMB2855 Single Network Processor Base Card (ATCA)
Option Cards
Intel® IXD4OC12T1F Quad OC-3/OC-12 I/O Option CardIntel® IXD1OC48T1F Single OC-48 I/O Option CardIntel® IXD4GETOC Quad Gigabit Ethernet I/O Option CardIntel® IXQDR2416 16MB QDR-II SRAM Memory Module Option Card
Intel® IXDP24XX Advanced Development Platforms
Modular Platforms to Accelerate Development of Network Access and Edge Applications Based on the Intel® IXP2400 Network Processor
Choice of Development Platforms Based on Design Requirements:
Intel® IXDP2400 Advanced Development Platform
A dual-chip implementation ideal for developing access and edge applications spanning full duplex OC-12/1GbE to OC-48/4 GbE line rates, such as an OC-48 DSLAM.
Intel® IXDP2401 Advanced Development Platform
Standards-based, PICMG 3.0 Advanced Telecom Computing Architecture* (AdvancedTCA*) compliant single chip implementation ideal for designing access and edge applications spanning OC-3 to 2xOC-12/2xGbE line rates, such as a multi-service switch or edge router.
These development platforms can be used in several ways:
Developers can write code and run simulations in a Windows* based PC environment using the graphical workbench and the cycle-accurate simulator, and then use the development platform to verify system functionality even before the customer hardware is available.
Hardware design engineers can reuse schematic source files included in their board design to jump-start their board development effort.
Developers can validate a design using the base card and mezzanine cards available from Intel, or design and test a custom I/O subsystem using the development platform prior to committing to a full board design.
Developers can design a proprietary switch fabric card, and use an interface on the base card to implement a fabric backplane.
Choice of Development Platforms Based on Design Requirements:
Intel® IXDP2400 Advanced Development Platform
A dual-chip implementation ideal for developing access and edge applications spanning full duplex OC-12/1GbE to OC-48/4 GbE line rates, such as an OC-48 DSLAM.
Intel® IXDP2401 Advanced Development Platform
Standards-based, PICMG 3.0 Advanced Telecom Computing Architecture* (AdvancedTCA*) compliant single chip implementation ideal for designing access and edge applications spanning OC-3 to 2xOC-12/2xGbE line rates, such as a multi-service switch or edge router.
These development platforms can be used in several ways:
Developers can write code and run simulations in a Windows* based PC environment using the graphical workbench and the cycle-accurate simulator, and then use the development platform to verify system functionality even before the customer hardware is available.
Hardware design engineers can reuse schematic source files included in their board design to jump-start their board development effort.
Developers can validate a design using the base card and mezzanine cards available from Intel, or design and test a custom I/O subsystem using the development platform prior to committing to a full board design.
Developers can design a proprietary switch fabric card, and use an interface on the base card to implement a fabric backplane.
Intel® IXDP2351 Advanced Development Platform
Modular AdvancedTCA* Platform to Accelerate Development of Network Access and Edge Applications Based on the Intel® IXP2350 Network Processor.
The Intel® IXDP2351 Advanced Development Platform enhances the value of the Intel® IXP2350 network processor by providing a robust environment that can dramatically accelerate the development and validation of new products designed for T1/E1/J1 to OC-12 line rates. The development platform may be used in several ways.
Developers can write code and run simulation in a Windows*-based PC environment using the graphical workbench and the cycle-accurate simulator, and then verify system functionality even before the target hardware is available.
Hardware design engineers can use schematic source files and other design documents, such as design guides and mechanical drawings included in the web-based Intel® Internet Exchange Architecture (Intel® IXA) Hardware Development Kit to jump-start board development.
Developers can validate a design using the base card, network processor module, and mezzanine cards available from Intel, or design and test a custom I/O subsystem using the development platform prior to committing to a full board design.
With the IXDP2351 platform, developers can add extra AdvancedTCA* boards from Intel as well as third parties to prototype more complete systems.
Developers can support a variety of AdvancedTCA fabric interfaces through a defined fabric interface mezzanine.
The Intel® IXDP2351 Advanced Development Platform enhances the value of the Intel® IXP2350 network processor by providing a robust environment that can dramatically accelerate the development and validation of new products designed for T1/E1/J1 to OC-12 line rates. The development platform may be used in several ways.
Developers can write code and run simulation in a Windows*-based PC environment using the graphical workbench and the cycle-accurate simulator, and then verify system functionality even before the target hardware is available.
Hardware design engineers can use schematic source files and other design documents, such as design guides and mechanical drawings included in the web-based Intel® Internet Exchange Architecture (Intel® IXA) Hardware Development Kit to jump-start board development.
Developers can validate a design using the base card, network processor module, and mezzanine cards available from Intel, or design and test a custom I/O subsystem using the development platform prior to committing to a full board design.
With the IXDP2351 platform, developers can add extra AdvancedTCA* boards from Intel as well as third parties to prototype more complete systems.
Developers can support a variety of AdvancedTCA fabric interfaces through a defined fabric interface mezzanine.
More of what you want, on the move
Intel® Centrino® Duo mobile technology now available with Intel® Core™2 Duo mobile processors
Dual-Core Intel® Xeon® processor 3000 sequence
Intel's new server processor for small businesses and value conscious buyers.
Dual-Core Intel® Xeon® Processor 3000 Sequence
Intel's new server processor for small businesses and value conscious buyers.
Dual-Core Intel® Xeon® processor 7100Δ series
Scalable transaction performance and proven reliability for demanding enterprise applications and help you consolidate and control costs with Intel® Virtualization Technology.
Laptop Processors
Intel® Core™ processor family delivers advanced mobile performance and is built for energy-efficient power savings.
Intel ® 3000 and 3010 Chipsets
The Intel® 3000 and 3010 chipsets are designed for use with Dual-Core Intel® Xeon® 3000 Sequence, Intel® Pentium® 4 processor 600 Sequence, Intel® Pentium® D processor 800 Sequence and 900 Sequence, and Intel® Celeron® D, in the LGA775 package in entry-level UP server platforms.
Quad-Core Intel® Xeon® Processor
The industry's first quad-core processor for mainstream servers provides break through performance and capabilities.
The world's first quad-core desktop processor
Experience unmatched processor performance on highly-threaded apps¹ with the Intel® Core™2 Extreme quad-core processor QX6700.
Intel ® 946PL/GZ Express Chipset
The Intel 946 Express Chipset family continues the Intel chipset legacy and extends it to new levels with purpose-built capabilities designed specifically to address the key needs of the home user.
Intel® Core™2 Quad Processor
Blows through processor-intensive tasks in the most demanding multitasking environments and makes the most of highly threaded applications.
Virtualization
Consolidate more applications onto fewer servers to increase the efficiency, dependability, and responsiveness of your data center.
Quad-Core Intel® Xeon® Processor
The industry's first quad-core processor for mainstream servers provides break through performance and capabilities.
Intel ® G33 Express Chipset
Desktop PC platforms based on the Intel® G33 Express Chipset, combined with either the Intel® Core™2 Duo processor or Intel® Core™2 Quad processor, deliver new technologies and innovating capabilities for digital home consumers.
Intel ® G31 Express Chipset
Desktop PC platforms with the Intel® G31 Express Chipset, combined with either the Intel® Core™2 Duo or the Intel® Core™2 Quad processor, deliver new technologies and innovating capabilities for consumers.
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