Intel® IXP2350 Network Processor

Enables Access and Edge Applications to 2 Gbps
The Intel® IXP2350 network processor extends Intel's fully programmable architecture to new, lower cost/performance points for access and edge applications, including broadband access devices, wireless infrastructure systems, routers and multi-service switches.To meet today's and tomorrow's demanding dataplane performance requirements, the IXP2350 network processor provides a powerful, integrated control plane processor in the same chip. The high-speed core (up to 1.2 GHz) incorporates advanced I/O and memory features, enabling customers to eliminate an external control plane processor in many applications. Additional hardware-assisted features in the IXP2350 network processor increase performance and simplify development.
Features and benefits
Four integrated programmable microengines (MEv2) with 8K instruction program stores running up to 900 MHz
Flexible multi-threaded RISC processors can be programmed to deliver intelligent transmit and receive processing, with robust software development environment for rapid product development
Integrated Intel XScale® core:
32 Kbytes - Instruction cache
32 Kbytes - Data cache
Up to 1,200 MHz
Embedded 32-bit RISC core for high performance processing of complex algorithms, route table maintenance and system-level management functions. Lowers system cost by eliminating external host processor.
Integrated 512 Kbytes L2 push cache performance
Improves CPU performance and MEv2 to Intel XScale core and PCI to Intel XScale core communication
Two unidirectional 32-bit media interfaces (Rx and Tx) programmable as SPI-3 or UTOPIAEach path configurable for 4x8-bit, 2x16-bit, 1x32-bit or combinations of 8 & 16-bit data paths
Supports industry standard cell and packet interfaces to media and fabric devices; simplifies design and interface to custom ASIC devicesSupports up to 127 ports using a 16-bit UTOPIA-2 MPHY mode
Two integrated Gigabit Ethernet MACs
Lowers system cost, power and board real estate
Two integrated 10/100 Ethernet MACs
Can be used as debugging ports or control signal ports. Lowers system cost, power and board real estate.
Integrated high speed serial controller:
256 HDLC channel controller(64 channels when configured with dynamic timeslot remap)
ATM-TC
Up to 16xT1/E1/J1 TDM links
Performs inverse multiplexing over ATM (IMA), which provides lower system cost, power and board real estate
Integrated cryptography accelerator
Provides up to 200 Mbps bulk encryption (DES/SHA-1) capability. Supports AES, DES and 3DES encryption algorithms as well as SHA-1 and MD5 hashing algorithms.
Two industry standard DDR DRAM interfaces:
One 64-bit + ECC DDR300 low latency channel (up to 2GB) optimized for microengine use (not available on 300 MHz ME configuration)
One 32-bit + ECC DDR300 low latency channel (up to 1GB) optimized for the Intel XScale core
Memory subsystem supports the network processor store-and-forward processing model. Separate memory channels for Intel XScale core and microengines improves data plane and control plane performance.
I/O coherency for Intel XScale core DRAM
Improves performance through accelerated control plane/data plane communications
One industry standard QDR SRAM interface (not available on 300 MHz ME configuration)
Provides industry standard interface for memory subsystem for look-up tables and access lists, or co-processors (such as CAM/TCAM)
Asynchronous control interface supports 8 or 16-bit slow port devices via 16-bit expansion bus
Provides control interface for connecting to microprocessor port of PHY devices and flash memory. Provides a direct connection to DSP via HPI.
Hardware support for memory access queuing
Simplifies application development and reduces system cost
JTAG support
Improves hardware debug ability
Intel® IXA Software Development Kit (SDK) Intel® Hardware Development Platform
Industry standard AdvancedTCA* form factor hardware reference design and state of the art development tools improves time to market via robust hardware and software development tools
1752 ball FCBGA 42.5 mm x 42.5 mm package
Minimizes board layers, providing easier board layer routing and lower cost